Analysis of the Thermal Stress and Strain on Arrigo Fiammingo’s Artistic Window in the Cathedral of Perugia

2001 ◽  
Vol 123 (6) ◽  
pp. 1173-1180 ◽  
Author(s):  
Cinzia Buratti
Keyword(s):  
Thermal Stress ◽  
Thermal Stresses ◽  
Actual State ◽  
Stress And Strain ◽  
Work Of Art ◽  
Temperature Distributions ◽  
Software Program ◽  
Thermal Stress And Strain

Thermal stress can damage fragile materials such as glass. It is a worrisome problem if the glass is a work of art, such as the polychromatic window of Arrigo Fiammingo (1565), in the Cathedral of Perugia, the topic of this paper. The window surface, irradiated by sunlight, suffers different thermal stresses, according to the color of the glass elements. In the present paper a calculation of stresses and strains on the window is carried out, for different temperature distributions due to sunlight, by using the ANSYS 5.3 software program. Results are compared with the actual state of the fissures on the window.

scholarly journals Theoretical study to find the thermal stress and strain generated in the Wood silica using lasers

2005 ◽  
Vol 2 (1) ◽  
pp. 73-80
Author(s):  
Baghdad Science Journal
Keyword(s):  
Thermal Stress ◽  
Laser Beam ◽  
Silica Glass ◽  
Thermal Stresses ◽  
Research Study ◽  
Theoretical Study ◽  
Stress And Strain ◽  
Soda Glass ◽  
Glass Silica ◽  
Thermal Stress And Strain

In this research study theory to find the stress and emotion gases in the glass as a result of exposure to pulses of the laser beam has been the study using vehicles three major on-system axes cylindrical (r, 0, z), where I took three models of glass silica glass soda glass fused and shedtwo types of lasers where the study showed that the thermal stresses and emotions ...

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

1989 ◽  
Vol 111 (1) ◽  
pp. 2-8 ◽  
Author(s):  
J. H. Lau
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Thermal Stress ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Mechanical Behavior ◽  
Thermal Stresses ◽  
Stress And Strain ◽  
Plastic Analysis ◽  
Chip Carrier

An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed stress and strain distributions and whole-field displacements of the assembly are also provided for a better understanding of its mechanical behavior during thermal cycling. It was found that the stresses and strains in the PQFP solder joint are smaller than those in the plastic-leaded-chip-carrier (PLCC) solder joint. The results presented herein should be useful in the design for reliability of this class of surface mount assemblies.

Sign in / Sign up

Export Citation Format

Share Document