Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging

2000 ◽  
Vol 123 (1) ◽  
pp. 19-33 ◽  
Author(s):  
Chandra S. Desai ◽  
Russell Whitenack
Keyword(s):  
Stress Analysis ◽  
Fatigue Failure ◽  
Constitutive Modeling ◽  
Electronic Packaging ◽  
Cyclic Fatigue ◽  
Thermomechanical Analysis ◽  
Design Analysis ◽  
Thermomechanical Stress ◽  
Disturbed State Concept ◽  
Approximate Procedure

A number of models for thermomechanical stress analysis and fatigue failure of materials are reviewed and their capabilities and limitations are identified. The unified disturbed state concept (DSC) for constitutive modeling of materials and interfaces is presented and compared with other approaches. An approximate procedure based on the DSC is proposed for accelerated design-analysis and cyclic fatigue failure. Solutions of example problems using the DSC and associated computer (FE) procedures are included to illustrate its integrated and improved capabilities for analysis of stresses, strains, microcracking, fracture and fatigue failure, and reliability.

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

1997 ◽  
Vol 119 (4) ◽  
pp. 294-300 ◽  
Author(s):  
C. S. Desai ◽  
J. Chia ◽  
T. Kundu ◽  
J. L. Prince
Keyword(s):  
Laboratory Test ◽  
Constitutive Modeling ◽  
Electronic Packaging ◽  
Cyclic Fatigue ◽  
Failure Behavior ◽  
Thermomechanical Response ◽  
Disturbed State Concept ◽  
Test Behavior ◽  
New Criterion

The disturbed state concept (DSC) presented here provides a unified and versatile methodology for constitutive modeling of thermomechanical response of materials and interfaces/joints in electronic chip-substrate systems. It allows for inclusion of such important features as elastic, plastic and creep strains, microcracking and degradation, strengthening, and fatigue failure. It provides the flexibility to adopt different hierarchical versions in the range of simple (e.g., elastic) to sophisticated (thermoviscoplastic with microcracking and damage), depending on the user’s specific need. This paper presents the basic theory and procedures for finding parameters in the model based on laboratory test data and their values for typical solder materials. Validation of the models with respect to laboratory test behavior and different criteria for the identification of cyclic fatigue and failure, including a new criterion based on the DSC and design applications, are presented in the compendium paper (Part II, Desai et al., 1997). Based on these results, the DSC shows excellent potential for unified characterization of the stress-strain-strength and failure behavior of engineering materials in electronic packaging problems.

Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept

2003 ◽  
Author(s):  
Russell D. Whitenack ◽  
Chandra S. Desai
Keyword(s):  
Finite Element ◽  
Reliability Analysis ◽  
Constitutive Modeling ◽  
Electronic Packaging ◽  
Analysis Tool ◽  
Disturbed State Concept ◽  
Powerful Approach ◽  
Finite Element Procedure ◽  
Cycles To Failure

The disturbed state concept (DSC) presented herein represents a unified and powerful approach for constitutive modeling of materials and interfaces in electronic packaging. Together with the computer finite element procedure it provides an analysis tool for calculation of stresses, strains, disturbance and cycles to failure. The accelerated procedure allows economical approximation of cycles to failure and distribution of disturbance at different cycles for design and reliability.

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part II—Unified Constitutive Models, Validation, and Design

1997 ◽  
Vol 119 (4) ◽  
pp. 301-309 ◽  
Author(s):  
C. S. Desai ◽  
J. Chia ◽  
T. Kundu ◽  
J. L. Prince
Keyword(s):  
Electronic Packaging ◽  
Constitutive Models ◽  
Cyclic Fatigue ◽  
Failure Model ◽  
Thermomechanical Response ◽  
Disturbed State Concept ◽  
Model Predictions ◽  
Powerful Means ◽  
Models Validation

The constitutive modeling approach based on the disturbed state concept (DSC) described in Part I, provides a unified basis for the characterization of thermomechanical response of materials and joints in electronic chip-substrate systems. Using the material constants given in Part I, the DSC model predictions, obtained by integrating the incremental constitutive equations, are shown here to provide satisfactory backpredietions of stress-strain, fatigue, and failure responses of typical solder materials. The DSC also provides a simple criterion based on the critical disturbance to identify cyclic fatigue failure. Model predictions show good correlation with those from previous models. It is also shown how the DSC model can be used for design applications. Overall, based on Papers I and II, it can be stated that the DSC can provide a new and powerful means to characterize the thermomechanical behavior of materials and joints in a number of problems in electronic packaging.

Quantitative Relationship between Strain and Acoustic Emission Response in Monitoring Fatigue Damage

2013 ◽  
Vol 66 (1) ◽  
Author(s):  
M. Mohammad ◽  
S. Abdullah ◽  
N. Jamaludin ◽  
O. Innayatullah
Keyword(s):  
Acoustic Emission ◽  
Failure Mechanism ◽  
Fatigue Failure ◽  
Quantitative Relationship ◽  
Steel Specimen ◽  
Cyclic Fatigue ◽  
Steel Component ◽  
Specific Data ◽  
The Relationship ◽  
Ae Signals

This study was carried out to investigate the relationship between the strain and acoustic emission (AE) signals, thus, to confirm the capability of AE technique to monitor the fatigue failure mechanism of a steel component. To achieve this goal, strain and AE signals were captured on the steel specimen during the cyclic fatigue test.  Both signals were collected using specific data acquisition system by attaching the strain gauge and AE piezoelectric transducer simultaneously at the specimen during the test. The stress loading used for the test was set at 600 MPa, and the specimens were fabricated using the SAE 1045 carbon steel.  The related parameters for both signals were determined at every 2000 seconds until the specimen failed.  It was found that a meaningful correlation of all parameters, i.e. amplitude, kurtosis and energy, was established. Finally, all AE parameters are correlated with the damage values, which have been estimated using the Coffin-Manson model.  Hence, it was suggested that the AE technique can be used as a monitoring tool for fatigue failure mechanism in a steel component.

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