CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

2000 ◽  
Vol 122 (3) ◽  
pp. 255-261 ◽  
Author(s):  
John H. L. Pang ◽  
C. W. Seetoh ◽  
Z. P. Wang

Three-dimensional nonlinear finite element analysis of a ceramic ball grid array (CBGA) package was conducted to determine the solder joint creep and plastic strain deformations in a simulated thermal cycling loading. Two methods of analysis were carried out to model the creep deformations during the dwell and during the temperature ramps in the thermal cycling loading. The equivalent plastic and creep strains are presented for the two analysis method to demonstrate the differences in the strain components. Both creep and plastic strain fatigue life prediction models were used to estimate the thermal cycling life of CBGA solder joints subjected to accelerated thermal cycling tests. The lives predicted using this nonlinear finite element analysis results were satisfactory and conservative compared to the experimental test results. [S1043-7398(00)01103-8]

2013 ◽  
Vol 456 ◽  
pp. 55-59
Author(s):  
Ren Bin Zhou ◽  
Xue Bing Liao ◽  
An Qing Ming ◽  
Yong Feng Zhang

Studying the armor-piercing effect of armor-piercing bomb that attacks aluminum target is essential, because the target can be considered the simulation of the actual fight equipment. Based on the hypothesis about building the fraction field, the armor-piercing effect of armor-piercing bomb is analyzed, and the velocity and the intruding depth parameter model of armor-piercing effect are established. Taking a certain armor-piercing bomb as example, the intruding processes of armor-piercing effect are simulated by using the nonlinear finite element analysis program LS-DYNA, while aluminum target simulates the wall of combat equipment in two different conditions. At last, the finite element simulated results are given and analyzed that agree with the experiments.


Sign in / Sign up

Export Citation Format

Share Document