Cryo‐focussed ion beam in Life Sciences (and beyond)

2021 ◽  
Vol 281 (2) ◽  
pp. 109-111
Author(s):  
D. A. M. de Winter ◽  
C. D. J. Parmenter
2019 ◽  
Vol 297 ◽  
pp. 100-110 ◽  
Author(s):  
Nick Lucas ◽  
Kelsey E. Seyfang ◽  
Andrew Plummer ◽  
Michael Cook ◽  
K. Paul Kirkbride ◽  
...  

2018 ◽  
Vol 24 (1) ◽  
pp. 204-213
Author(s):  
Ji Li ◽  
Tom Monaghan ◽  
Robert Kay ◽  
Ross James Friel ◽  
Russell Harris

Purpose This paper aims to explore the potential of ultrasonic additive manufacturing (UAM) to incorporate the direct printing of electrical materials and arrangements (conductors and insulators) at the interlaminar interface of parts during manufacture to allow the integration of functional and optimal electrical circuitries inside dense metallic objects without detrimental effect on the overall mechanical integrity. This holds promise to release transformative device functionality and applications of smart metallic devices and products. Design/methodology/approach To ensure the proper electrical insulation between the printed conductors and metal matrices, an insulation layer with sufficient thickness is required to accommodate the rough interlaminar surface which is inherent to the UAM process. This in turn increases the total thickness of printed circuitries and thereby adversely affects the integrity of the UAM part. A specific solution is proposed to optimise the rough interlaminar surface through deforming the UAM substrates via sonotrode rolling or UAM processing. Findings The surface roughness (Sa) could be reduced from 4.5 to 4.1 µm by sonotrode rolling and from 4.5 to 0.8 µm by ultrasonic deformation. Peel testing demonstrated that sonotrode-rolled substrates could maintain their mechanical strength, while the performance of UAM-deformed substrates degraded under same welding conditions ( approximately 12 per cent reduction compared with undeformed substrates). This was attributed to the work hardening of deformation process which was identified via dual-beam focussed ion beam–scanning electron microscope investigation. Originality/value The sonotrode rolling was identified as a viable methodology in allowing printed electrical circuitries in UAM. It enabled a decrease in the thickness of printed electrical circuitries by ca. 25 per cent.


2012 ◽  
Vol 1432 ◽  
Author(s):  
Jonathan D. Major ◽  
Leon Bowen ◽  
Robert E. Treharne ◽  
Ken Durose

ABSTRACTTwo issues relating to the determination of junction position in thin film CdTe solar cells have been investigated. Firstly, the use of a focussed ion beam (FIB) milling as a method of sample preparation for electron beam induced current (EBIC) analysis is demonstrated. It is superior to fracturing methods. High quality secondary electron and combined secondary electron/EBIC images are presented and interpreted for solar cells with CdTe layers deposited by both close space sublimation (CSS) or RF sputtering. Secondly, it was shown that in an RF-sputtered CdTe device, while the photovoltaic junction was buried ~1.1 μm from the metallurgical interface, the shape of the external quantum efficiency (EQE) curve did not indicate the presence of a buried homo-junction. SCAPS modelling was used to verify that EQE curve shapes are not sensitive to junctions buried < 1.5μm from the CdTe/CdS interface.


2012 ◽  
Vol 110 (4) ◽  
pp. 935-941
Author(s):  
Jan Junis Rindermann ◽  
Mohammed Henini ◽  
Pavlos G. Lagoudakis
Keyword(s):  
Ion Beam ◽  

AIP Advances ◽  
2017 ◽  
Vol 7 (1) ◽  
pp. 015203 ◽  
Author(s):  
A. Beguivin ◽  
D. C. M. C. Petit ◽  
R. Mansell ◽  
R. P. Cowburn

2013 ◽  
Author(s):  
J. Li ◽  
J. N. Sun ◽  
M. M. Miliar ◽  
J. M. Ritchie ◽  
X. Luo ◽  
...  
Keyword(s):  
Ion Beam ◽  

2019 ◽  
Vol 202 ◽  
pp. 121-127 ◽  
Author(s):  
J.E. Halpin ◽  
R.W.H. Webster ◽  
H. Gardner ◽  
M.P. Moody ◽  
P.A.J. Bagot ◽  
...  

2020 ◽  
Vol 11 ◽  
pp. 1504-1515
Author(s):  
Matthew R Ball ◽  
Richard J M Taylor ◽  
Joshua F Einsle ◽  
Fouzia Khanom ◽  
Christelle Guillermier ◽  
...  

The helium ion microscope (HIM) is a focussed ion beam instrument with unprecedented spatial resolution for secondary electron imaging but has traditionally lacked microanalytical capabilities. With the addition of the secondary ion mass spectrometry (SIMS) attachment, the capabilities of the instrument have expanded to microanalysis of isotopes from Li up to hundreds of atomic mass units, effectively opening up the analysis of all natural and geological systems. However, the instrument has thus far been underutilised by the geosciences community, due in no small part to a lack of a thorough understanding of the quantitative capabilities of the instrument. Li represents an ideal element for an exploration of the instrument as a tool for geological samples, due to its importance for economic geology and a green economy, and the difficult nature of observing Li with traditional microanalytical techniques. Also Li represents a “best-case” scenario for isotopic measurements. Here we present details of sample preparation, instrument sensitivity, theoretical, and measured detection limits for both elemental and isotopic analysis as well as practicalities for geological sample analyses of Li alongside a discussion of potential geological use cases of the HIM–SIMS instrument.


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