Low thermal conductivity of SrTiO 3 −LaTiO 3 and SrTiO 3 −SrNbO 3 thermoelectric oxide solid solutions

2021 ◽  
Author(s):  
Yuqiao Zhang ◽  
Hai Jun Cho ◽  
Kenyu Sugo ◽  
Masashi Mikami ◽  
Sungmin Woo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solutions ◽  
Thermoelectric Oxide ◽  
Low Thermal Conductivity

Low Thermal Conductivity in Thermoelectric Oxide-Based Multiphase Composites

2019 ◽  
Vol 48 (11) ◽  
pp. 7551-7561 ◽  
Author(s):  
Mario Wolf ◽  
Kaan Menekse ◽  
Alexander Mundstock ◽  
Richard Hinterding ◽  
Frederik Nietschke ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermoelectric Oxide ◽  
Low Thermal Conductivity ◽  
Multiphase Composites

scholarly journals Structures, and Thermophysical Properties Characterizations of (La1-xHox)3NbO7 Solid Solutions as Thermal Barrier Coatings

2021 ◽  
Vol 8 ◽  
Author(s):  
Lin Chen ◽  
Yitao Wang ◽  
Qi Zheng ◽  
Jing Feng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Insulation ◽  
Solid Solutions ◽  
High Hardness ◽  
Lattice Stability ◽  
Low Thermal Conductivity ◽  
Thermal Expansion Coefficients ◽  
Anharmonic Lattice ◽  
Temperature Lattice ◽  
High Thermal Expansion

A sequence of (La1-xHox)3NbO7 solid solutions were fabricated in this work, which were studied as candidate for thermal insulation materials. The lattices were identified via XRD, when SEM and EDS were used to characterize the microstructures and element distributions. The results showed that the highest modulus, hardness, and toughness of (La1-xHox)3NbO7 were 196 GPa, 9.2 GPa, and 1.6 MPa m1/2, respectively, and they accorded with the mechanical property requirements. Also, a low thermal conductivity (1.06 W m−1 K−1) and high thermal expansion coefficients (TECs: 11.3 × 10−6 K−1) were simultaneously realized in (La3/6Ho3/6)3NbO7, at high temperatures. No phase transition was detected up to 1,200°C, which proved their good high-temperature lattice stability. The intense anharmonic lattice vibrations might contribute to the outstanding thermal properties of (La1-xHox)3NbO7 ceramics. The suitable modulus, high hardness, low thermal conductivity, and high TECs of (La1-xHox)3NbO7 solid solutions proclaimed that they were exceptional thermal insulation ceramics.

Extremely Low Thermal Conductivity in Thermoelectric Ge0.55Pb0.45Te Solid Solutions via Se Substitution

2016 ◽  
Vol 28 (17) ◽  
pp. 6367-6373 ◽  
Author(s):  
Junqin Li ◽  
Haijun Wu ◽  
Di Wu ◽  
Caiyan Wang ◽  
Zhiping Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Solid Solutions ◽  
Low Thermal Conductivity ◽  
Se Substitution

Structure and Thermoelectric Properties of New Quaternary Tin and Lead Bismuth Selenides, K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1+xSn5-xBi11+xSe22

2000 ◽  
Vol 626 ◽  
Author(s):  
Antje Mrotzek ◽  
Kyoung-Shin Choi ◽  
Duck-Young Chung ◽  
Melissa A. Lane ◽  
John R. Ireland ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Single Crystal ◽  
Thermoelectric Properties ◽  
Three Dimensional ◽  
Structure Type ◽  
Narrow Gap ◽  
Low Thermal Conductivity ◽  
Seebeck Coefficients ◽  
Metal Atoms ◽  
Anionic Framework

ABSTRACTWe present the structure and thermoelectric properties of the new quaternary selenides K1+xM4–2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22. The compounds K1+xM4-2xBi7+xSe15 (M= Sn, Pb) crystallize isostructural to A1+xPb4-2xSb7+xSe15 with A = K, Rb, while K1-xSn5-xBi11+xSe22 reveals a new structure type. In both structure types fragments of the Bi2Te3-type and the NaCl-type are connected to a three-dimensional anionic framework with K+ ions filled tunnels. The two structures vary by the size of the NaCl-type rods and are closely related to β-K2Bi8Se13 and K2.5Bi8.5Se14. The thermoelectric properties of K1+xM4-2xBi7+xSe15 (M = Sn, Pb) and K1-xSn5-xBi11+xSe22 were explored on single crystal and ingot samples. These compounds are narrow gap semiconductors and show n-type behavior with moderate Seebeck coefficients. They have very low thermal conductivity due to an extensive disorder of the metal atoms and possible “rattling” K+ ions.

A Novel Poly(Ionic Liquid) as the Thermal Insulating Material

2020 ◽  
Vol 13 (3) ◽  
pp. 241-247
Author(s):  
Wenxin Wei ◽  
Guifeng Ma ◽  
Hongtao Wang ◽  
Jun Li
Keyword(s):  
Thermal Conductivity ◽  
Ionic Liquid ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Flame Resistance ◽  
Insulating Material ◽  
Low Thermal Conductivity ◽  
Thermal Insulating ◽  
Poly Ionic Liquid

Objective: A new poly(ionic liquid)(PIL), poly(p-vinylbenzyltriphenylphosphine hexafluorophosphate) (P[VBTPP][PF6]), was synthesized by quaternization, anion exchange reaction, and free radical polymerization. Then a series of the PIL were synthesized at different conditions. Methods: The specific heat capacity, glass-transition temperature and melting temperature of the synthesized PILs were measured by differential scanning calorimeter. The thermal conductivities of the PILs were measured by the laser flash analysis method. Results: Results showed that, under optimized synthesis conditions, P[VBTPP][PF6] as the thermal insulator had a high glass-transition temperature of 210.1°C, high melting point of 421.6°C, and a low thermal conductivity of 0.0920 W m-1 K-1 at 40.0°C (it was 0.105 W m-1 K-1 even at 180.0°C). The foamed sample exhibited much low thermal conductivity λ=0.0340 W m-1 K-1 at room temperature, which was comparable to a commercial polyurethane thermal insulating material although the latter had a much lower density. Conclusion: In addition, mixing the P[VBTPP][PF6] sample into polypropylene could obviously increase the Oxygen Index, revealing its efficient flame resistance. Therefore, P[VBTPP][PF6] is a potential thermal insulating material.

Origin of low thermal conductivity in monolayer PbI2

2021 ◽  
Vol 327 ◽  
pp. 114223
Author(s):  
E. Bolen ◽  
E. Deligoz ◽  
H. Ozisik
Keyword(s):  
Thermal Conductivity ◽  
Low Thermal Conductivity
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