scholarly journals Enhanced thermal stability by introducing TiN diffusion barrier layer between W and SiC

2019 ◽  
Vol 102 (9) ◽  
pp. 5613-5619 ◽  
Author(s):  
Ping Cheng ◽  
Steven DelaCruz ◽  
Dung‐Sheng Tsai ◽  
Zhongtao Wang ◽  
Carlo Carraro ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Diffusion Barrier Layer ◽  
Tin Diffusion Barrier

scholarly journals Plasma-Enhanced Atomic Layer Deposition of TiN Thin Films as an Effective Se Diffusion Barrier for CIGS Solar Cells

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 370
Author(s):  
Hyun-Jae Woo ◽  
Woo-Jae Lee ◽  
Eun-Kyong Koh ◽  
Seung Il Jang ◽  
Shinho Kim ◽  
...  
Keyword(s):  
Thin Films ◽  
Solar Cells ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Atomic Layer ◽  
Layer Deposition ◽  
Diffusion Barrier Layer ◽  
Tin Thin Films ◽  
Cigs Solar Cells ◽  
Tin Diffusion Barrier

Plasma-enhanced atomic layer deposition (PEALD) of TiN thin films were investigated as an effective Se diffusion barrier layer for Cu (In, Ga) Se2 (CIGS) solar cells. Before the deposition of TiN thin film on CIGS solar cells, a saturated growth rate of 0.67 Å/cycle was confirmed using tetrakis(dimethylamido)titanium (TDMAT) and N2 plasma at 200 °C. Then, a Mo (≈30 nm)/PEALD-TiN (≈5 nm)/Mo (≈600 nm) back contact stack was fabricated to investigate the effects of PEALD-TiN thin films on the Se diffusion. After the selenization process, it was revealed that ≈5 nm-thick TiN thin films can effectively block Se diffusion and that only the top Mo layer prepared on the TiN thin films reacted with Se to form a MoSe2 layer. Without the TiN diffusion barrier layer, however, Se continuously diffused along the grain boundaries of the entire Mo back contact electrode. Finally, the adoption of a TiN diffusion barrier layer improved the photovoltaic efficiency of the CIGS solar cell by approximately 10%.

Effects of the Microstructure of Platinum Electrode on the Oxidation Behavior of TiN Diffusion Barrier Layer

2003 ◽  
Vol 42 (Part 1, No. 2A) ◽  
pp. 630-633 ◽  
Author(s):  
Dong-Su Lee ◽  
Hyun-Jung Woo ◽  
Dong-Yeon Park ◽  
Jowoong Ha ◽  
Cheol Seong Hwang ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Diffusion Barrier ◽  
Oxidation Behavior ◽  
Platinum Electrode ◽  
Diffusion Barrier Layer ◽  
Tin Diffusion Barrier

Creep Deformation / Oxidation Behavior of Re-Cr-Ni Diffusion Barrier Coated Hastelloy-X at 970°C in Air

2008 ◽  
Vol 595-598 ◽  
pp. 107-116 ◽  
Author(s):  
Shigenari Hayashi ◽  
Mikihiro Sakata ◽  
Shigeharu Ukai ◽  
Toshio Narita
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Barrier Layer ◽  
Creep Deformation ◽  
Diffusion Barrier ◽  
Hastelloy X ◽  
Alloy Substrate ◽  
Barrier Coating ◽  
Diffusion Barrier Layer ◽  
Coated Alloy

High temperature oxidation / creep deformation behavior of a diffusion barrier coated Hastelloy-X alloy, with large grain size ~500μm, was investigated at 970°C in air with external tensile stress of 22.5, 27.5, 32, and 40MPa. The diffusion barrier coating formed on Hastelloy-X consisted of a duplex structure with an inner diffusion barrier layer of Re-Cr-Ni alloy, and an outer oxidation resistant layer of β-NiAl. Un coated bare Hastelloy-X alloy with same grain size was also examined under the same conditions for comparison. The composition of the as-coated diffusion barrier coating was (15~21)Ni, (33~37)Cr, (30~33)Re, (11~15)Mo, and (9~14)Fe. This composition corresponds to σ-phase in the Ni-Cr-Re ternary system, which is known as a topologically close packed, TCP phase. The composition of this diffusion barrier layer did not change during the experiment. The oxide scales formed after creep testing on the coated and un-coated alloy surfaces were needle-like θ-Al2O3, and Cr2O3 with small amount of FeCr2O4, respectively. Grain boundary oxidation was also found in the subsurface region of the un-coated alloy. The Al2O3 scale exhibited severe spallation, and many cracks were formed perpendicular to the stress direction. However, no spallation or cracks were observed in the Cr2O3. The creep rupture times for the diffusion barrier coated alloy were about 1.5 times longer than those for bare alloy at all creep stress conditions. The fracture surface after rupture indicates that fracture occurred along alloy grain boundaries in both the coated and un-coated alloy substrate. Many cavities and cracks were observed within the diffusion barrier coated alloy substrate. These cavities and cracks tended to propagate from the substrate toward the diffusion barrier layer, and then stopped at the Re-Cr-Ni / β-NiAl interface. Cracks formed in the un-coated alloy initiated at the tip of grain boundary oxides, and propagated into alloy substrate. However no major cavities were observed inside the alloy substrate. The stress index, n, for both specimens was about 6, and this indicates that the deformation mechanism of both samples was dislocation creep. These results suggest that the Re-Cr-Ni diffusion barrier layer acts as a barrier against the movement of dislocations at the interface with the alloy surface.

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