Investigation of grain boundary diffusion and grain growth of lithium zinc ferrites with low activation energy

2018 ◽  
Vol 101 (11) ◽  
pp. 5037-5045 ◽  
Author(s):  
Fang Xu ◽  
Huaiwu Zhang ◽  
Fei Xie ◽  
Yulong Liao ◽  
Yuanxun Li ◽  
...  
Keyword(s):  
Activation Energy ◽  
Grain Boundary ◽  
Grain Growth ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion

Simulation of Microstructural Evolution during Superplastic Deformation

1999 ◽  
Vol 601 ◽  
Author(s):  
B.-N. Kim ◽  
K. Hiraga
Keyword(s):  
Aspect Ratio ◽  
Grain Boundary ◽  
Grain Growth ◽  
Boundary Diffusion ◽  
Tensile Deformation ◽  
Grain Boundary Diffusion ◽  
Initial Value ◽  
The Matrix ◽  
Dynamic Growth ◽  
Equiaxed Grains

AbstractSuperplastic tensile deformation is simulated in 2 dimensions by incorporating grain boundary diffusion and concurrent grain growth derived from static and dynamic growth mechanisms. The following relationship is found between microstructural changes and deformation behavior for constant stress conditions. Grain boundary diffusion produces an increase in the aspect ratio of the matrix grains during deformation and the increased aspect ratio causes a change in creep rate parameters: the stress exponent is decreased from the initial value of 1.0 for equiaxed grains and the grain size exponent is increased from the initial value of 3.0. Accelerated grain growth is also found by the present simulation.

Grain Boundary Diffusion in Co/Cu and Co/Cr Magnetic Thin Films

1993 ◽  
Vol 313 ◽  
Author(s):  
John G. Holl-Pellerin ◽  
S.G.H. Anderson ◽  
P.S. Ho ◽  
K.R. Coffey ◽  
J.K. Howard ◽  
...  
Keyword(s):  
Thin Films ◽  
Activation Energy ◽  
Diffusion Coefficient ◽  
Grain Boundary ◽  
Photoelectron Spectroscopy ◽  
Boundary Diffusion ◽  
Magnetic Thin Films ◽  
Grain Boundary Diffusion ◽  
X Ray ◽  
Before And After

ABSTRACTX-ray photoelectron spectroscopy (XPS) has been used to investigate grain boundary diffusion of Cu and Cr through 1000 Å thick Co films in the temperature range of 325°C to 400°C. Grain boundary diffusivities were determined by modeling the accumulation of Cu or Cr on Co surfaces as a function of time at fixed annealing temperature. The grain boundary diffusivity of Cu through Co is characterized by a diffusion coefficient, D0gb, of 2 × 104 cm2/sec and an activation energy, Ea,gb, of 2.4 eV. Similarly, Cr grain boundary diffusion through Co thin films occurs with a diffusion coefficient, Do,gb, of 6 × 10-2cm2/sec and an activation energy, Ea,gb of 1.8 eV. The Co film microstructure has been investigated before and after annealing by x-ray diffraction and transmission electron Microscopy. Extensive grain growth and texturing of the film occurred during annealing for Co deposited on a Cu underlayer. In contrast, the microstructure of Co deposited on a Cr underlayer remained relatively unchanged upon annealing. Magnetometer Measurements have shown that increased in-plane coercivity Hc, reduced remanence squareness S, and reduced coercive squareness S* result from grain boundary diffusion of Cu and Cr into the Co films.

Diffusion Mechanisms in Nanocrystalline and Nanolaminated Au-Cu

2007 ◽  
Vol 266 ◽  
pp. 13-28 ◽  
Author(s):  
Alan F. Jankowski
Keyword(s):  
Low Temperature ◽  
Grain Boundary ◽  
Grain Growth ◽  
Boundary Diffusion ◽  
Bulk Diffusion ◽  
Grain Boundary Diffusion ◽  
Dominant Mechanism ◽  
Temperature Range ◽  
Diffusion Mechanisms ◽  
Kinetics Of

Thermal anneal treatments are used to identify the temperature range of the two dominant diffusion mechanisms – bulk and grain boundary. To assess the transition between mechanisms, the low temperature range for bulk diffusion is established utilizing the decay of static concentration waves in composition-modulated nanolaminates. These multilayered structures are synthesized using vapor deposition methods as thermal evaporation and magnetron sputtering. However, at low temperature the kinetics of grain-boundary diffusion are much faster than bulk diffusion. The synthesis of Au-Cu alloys (0-20 wt.% Cu) with grain sizes as small as 5 nm is accomplished using pulsed electro-deposition. Since the nanocrystalline grain structure is thermally unstable, these structures are ideal for measuring the kinetics of grain boundary diffusion as measured by coarsening of grain size with low temperature anneal treatments. A transition in the dominant mechanism for grain growth from grain boundary to bulk diffusion is found with an increase in temperature. The activation energy for bulk diffusion is found to be 1.8 eV·atom-1 whereas that for grain growth at low temperatures is only 0.2 eV·atom-1. The temperature for transitioning from the dominant mechanism of grain boundary to bulk diffusion is found to be 57% of the alloy melt temperature and is dependent on composition.

Grain boundary Diffusion of Ni through Pd2Si

1983 ◽  
Vol 25 ◽  
Author(s):  
E. C. Zingu ◽  
J. W. Mayer
Keyword(s):  
Thin Film ◽  
Activation Energy ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Boundary Diffusion ◽  
Rutherford Backscattering Spectrometry ◽  
High Mobility ◽  
Grain Boundary Diffusion ◽  
Rutherford Backscattering

ABSTRACTInterdiffusion in the Si<100>/Pd2Si/Ni and Si<111>/Pd2Si/Ni thin film systems has been investigated using Rutherford backscattering spectrometry. Nickel is found to diffuse along the grain boundaries of polycrystalline Pd2Si upon which it accumulates at the Si<100>Pd2Si interface. The high mobility of Ni compared to that of si suggests that Pd diffuses faster than Si along the Pd2Si grain boundaries. An activation energy of 1.2 eV is determined for Ni grain boundary diffusion in Pd2Si.

Study of Fe Diffusion in Cr2O3 by Secondary Ion Mass Spectrometry

2005 ◽  
Vol 237-240 ◽  
pp. 940-945
Author(s):  
Antônio Claret Soares Sabioni ◽  
Anne Marie Huntz ◽  
F. Silva ◽  
François Jomard
Keyword(s):  
Mass Spectrometry ◽  
Activation Energy ◽  
Grain Boundary ◽  
Boundary Diffusion ◽  
Secondary Ion Mass Spectrometry ◽  
Bulk Diffusion ◽  
Grain Boundary Diffusion ◽  
Iron Diffusion ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Chromia protective layers are used to prevent corrosion by oxidation of many alloys, such as the stainless steels, for instance. To check if chromia is a barrier to the outward diffusion of iron in these alloys, iron diffusion in chromia was studied in both polycrystals and oxide films formed by oxidation of Ni-30Cr alloy in the temperature range 700-1100°C at an oxygen pressure equal to 10-4 atm. An iron film of about 70 nm thick was deposited on the chromia surface, and after the diffusing treatment, the iron depth profiles were established by secondary ion mass spectrometry (SIMS). Using a solution of the Fick’s second law for diffusion from a thick film, effective or bulk diffusion coefficients were determined in a first penetration domain. Then, Le Claire’s and Hart’s models allowed both the bulk diffusion coefficient and the grain boundary diffusion parameter (aDgbd) to be obtained in a second penetration domain. Iron bulk and grain boundary diffusion does not vary significantly according to the nature-microstructure of chromia. The activation energy of grain boundary diffusion is at least equal or even greater than the activation energy of bulk diffusion, probably on account of segregation phenomena. Iron diffusion was compared to cationic self-diffusion and related to the protective character of chromia.

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