Spatial ions distribution of the bonding interface in YAG/Nd:LuAG composite laser ceramic

2017 ◽  
Vol 100 (11) ◽  
pp. 5030-5037 ◽  
Author(s):  
Pande Zhang ◽  
Benxue Jiang ◽  
Yiguang Jiang ◽  
Ge Zhang ◽  
Shuilin Chen ◽  
...  
Keyword(s):  
Bonding Interface ◽  
Laser Ceramic ◽  
Composite Laser

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

2013 ◽  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Initial Crack ◽  
Bonding Interface ◽  
Interface Condition ◽  
Large Temperature ◽  
Bonded Interface ◽  
The Impact ◽  
Element Method

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

scholarly journals Interfacial Morphology and Bonding Mechanism of Explosive Weld Joints

2021 ◽  
Vol 34 (1) ◽  
Author(s):  
Tingting Zhang ◽  
Wenxian Wang ◽  
Zhifeng Yan ◽  
Jie Zhang
Keyword(s):  
Laminated Composite ◽  
Base Plate ◽  
Sine Wave ◽  
Laminated Plates ◽  
Bonding Interface ◽  
Interfacial Structure ◽  
Bonding Mechanism ◽  
Critical Material ◽  
Interfacial Morphology ◽  
Az31b Alloy

AbstractInterfacial structure greatly affects the mechanical properties of laminated plates. However, the critical material properties that impact the interfacial morphology, appearance, and associated bonding mechanism of explosive welded plates are still unknown. In this paper, the same base plate (AZ31B alloy) and different flyer metals (aluminum alloy, copper, and stainless steel) were used to investigate interfacial morphology and structure. SEM and TEM results showed that typical sine wave, wave-like, and half-wave-like interfaces were found at the bonding interfaces of Al/Mg, Cu/Mg and SS/Mg clad plates, respectively. The different interfacial morphologies were mainly due to the differences in hardness and yield strength between the flyer and base metals. The results of the microstructural distribution at the bonding interface indicated metallurgical bonding, instead of the commonly believed solid-state bonding, in the explosive welded clad plate. In addition, the shear strength of the bonding interface of the explosive welded Al/Mg, Cu/Mg and SS/Mg clad plates can reach up to 201.2 MPa, 147.8 MPa, and 128.4 MPa, respectively. The proposed research provides the design basis for laminated composite metal plates fabrication by explosive welding technology.

scholarly journals The Interfacial Characterization and Performance of Cu/Al-Conductive Heads Processed by Explosion Welding, Cold Pressure Welding, and Solid-Liquid Casting

Metals ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 237 ◽  
Author(s):  
Yanni Wei ◽  
Hui Li ◽  
Fu Sun ◽  
Juntao Zou
Keyword(s):  
Corrosion Resistance ◽  
Bonding Strength ◽  
Explosive Welding ◽  
Slag Inclusion ◽  
Explosion Welding ◽  
Bonding Interface ◽  
Pressure Welding ◽  
And Performance ◽  
Solid Liquid ◽  
Cold Pressure

The Cu/Al composites conductive head is widely used in hydrometallurgy as the core component of cathode plate. Its conductive properties directly affect the power consumption, and the bonding strength and corrosion resistance determine the conductive head service life. The Cu/Al conductive head prepared by explosion welding, cold pressure welding, and solid-liquid casting methods were investigated in this paper. The interface microstructure and compositions were examined by scanning electron microscope and X-ray energy dispersive spectrometry. The bonding strength, interface conductivity, and the corrosion resistance of three types of joints were characterized. The Cu/Al bonding interface produced by explosive welding presented a wavy-like morphology with typical defects and many of brittle compounds. A micro-interlocking effect was caused by the sawtooth structures on the cold pressure welding interface, and there was no typical metallurgical reaction on the interface. The Cu/Al bonding interface prepared by solid-liquid casting consisted mainly of an Al-Cu eutectic microstructure (Al2Cu+Al) and partial white slag inclusion. The thickness of the interface transition layer was about 200–250 µm, with defects such as holes, cracks, and unwelded areas. The conductivity, interfacial bonding strength, and corrosion resistance of the conductive head prepared by explosive welding were superior to the other two.

Evolution of bonding interface in Al/Al-Mg-Si alloy clad wire during heating at 500 ℃

2017 ◽  
Vol 679 ◽  
pp. 538-542 ◽  
Author(s):  
Xiang Wang ◽  
Ren-Guo Guan ◽  
Ying-Qiu Shang ◽  
Wei Wang ◽  
Ning Wang
Keyword(s):  
Bonding Interface
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