Ultrashort pulse laser processing of silica at high repetition rates-from network change to residual strain

2016 ◽  
Vol 8 (2) ◽  
pp. 233-238 ◽  
Author(s):  
Felix Zimmermann ◽  
Matthieu Lancry ◽  
Anton Plech ◽  
Sören Richter ◽  
Tobias Ullsperger ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Residual Strain ◽  
Ultrashort Pulse ◽  
Laser Processing ◽  
Ultrashort Pulse Laser ◽  
High Repetition ◽  
Network Change

scholarly journals Simulation of the laser-material interaction of ultrashort pulse laser processing of silicon nitride workpieces and the key factors in the ablation process

2021 ◽  
Author(s):  
Babak Soltani ◽  
Faramarz Hojati ◽  
Amir Daneshi ◽  
Bahman Azarhoushang
Keyword(s):  
Mathematical Model ◽  
Laser Ablation ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Laser Processing ◽  
Laser Power ◽  
Removal Rate ◽  
Ultrashort Pulse Laser ◽  
Laser Material ◽  
Material Interaction

AbstractUnderstanding the laser ablation mechanism is highly essential to find the effect of different laser parameters on the quality of the laser ablation. A mathematical model was developed in the current investigation to calculate the material removal rate and ablation depth. Laser cuts were created on the workpiece with different laser scan speeds from 1 to 10 mm s−1 by an ultrashort pulse laser with a wavelength of about 1000 nm. The calculated depths of laser cuts were validated via practical experiments. The variation of the laser power intensity on the workpiece’s surface during laser radiation was also calculated. The mathematical model has determined the laser-material interaction mechanism for different laser intensities. The practical sublimation temperature and ablated material temperature during laser processing are other data that the model calculates. The results show that in laser power intensities (IL) higher than 1.5 × 109 W cm−2, the laser-material interaction is multiphoton ionisation with no effects of thermal reaction, while in lower values of IL, there are effects of thermal damages and HAZ adjacent to the laser cut. The angle of incidence is an essential factor in altering incident IL on the surface of the workpiece during laser processing, which changes with increasing depth of the laser cut.

scholarly journals Ultrashort-pulse laser processing of transparent materials: insight from numerical and semi-analytical models

2016 ◽  
Author(s):  
Nadezhda M. Bulgakova ◽  
Vladimir P. Zhukov ◽  
Inam Mirza ◽  
Yuri P. Meshcheryakov ◽  
Jan Tomáštík ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Laser Processing ◽  
Analytical Models ◽  
Ultrashort Pulse Laser ◽  
Transparent Materials

High power parallel ultrashort pulse laser processing

2016 ◽  
Author(s):  
Arnold Gillner ◽  
Patrick Gretzki ◽  
Lasse Büsing
Keyword(s):  
Pulse Laser ◽  
High Power ◽  
Ultrashort Pulse ◽  
Laser Processing ◽  
Ultrashort Pulse Laser

Time-resolved visualization of high-repetition ultrashort pulse laser ablation

2020 ◽  
Vol 59 (2) ◽  
pp. 452
Author(s):  
Sebastian Kraft ◽  
Joerg Schille ◽  
Stefan Mauersberger ◽  
Lutz Schneider ◽  
Udo Loeschner
Keyword(s):  
Laser Ablation ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Pulse Laser Ablation ◽  
Time Resolved ◽  
Ultrashort Pulse Laser ◽  
High Repetition

scholarly journals Impacts of Ambient and Ablation Plasmas on Short- and Ultrashort-Pulse Laser Processing of Surfaces

Micromachines ◽  
2014 ◽  
Vol 5 (4) ◽  
pp. 1344-1372 ◽  
Author(s):  
Nadezhda Bulgakova ◽  
Alexei Panchenko ◽  
Vladimir Zhukov ◽  
Sergey Kudryashov ◽  
Antonio Pereira ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Laser Processing ◽  
Ultrashort Pulse Laser
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