scholarly journals C/C‐SiC component for metallic phase change materials

2020 ◽  
Vol 17 (5) ◽  
pp. 2040-2050 ◽  
Author(s):  
Veronika Stahl ◽  
Yuan Shi ◽  
Werner Kraft ◽  
Tim Lanz ◽  
Peter Vetter ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Metallic Phase

Analysis of the Applicability of Effective Thermophysical Properties to Composite Phase Change Materials

2021 ◽  
Vol 1016 ◽  
pp. 813-818
Author(s):  
Zi Wei Li ◽  
Elisabetta Gariboldi
Keyword(s):  
Energy Storage ◽  
Phase Change ◽  
Phase Change Materials ◽  
Effective Properties ◽  
Average Energy ◽  
Thermal Response ◽  
Metallic Phase ◽  
Stable Phase ◽  
Bottom Surface ◽  
Temperature Model

Coarse form-stable phase change materials (FS-PCMs) can tailor the properties of pure PCMs. This is often attained by the presence of high-melting, high-thermal conductivity metallic phase which enhances the thermal energy storage/release. The evaluation of the thermal response of these composite materials in unsteady conditions, is not an easy task, and simplifications introduced to deal with them must be carefully considered. A set of FS-PCMs of prismatic geometry with polymeric wax as PCM and an Al foam with various pore sizes, modelled as BCC lattice has been considered in this paper. The thermal response under a set of boundary conditions with constant heat flux at the bottom surface, all other being adiabatic, was investigated both by direct simulations approach modelling the two phases and the ‘1-temperature model’, which considers the material as homogeneous and characterized by a proper set of effective properties. The ‘1-temperature model’ is able to closely reproduce the whole the local thermal history only within certain validity ranges, even if it can well reproduce the ‘average’ energy storage due to the transformation of the PCM phase.

Magnetic Transition of Metallic Phase‐Change Materials

2020 ◽  
pp. 2000425
Author(s):  
Chao He ◽  
Chong Qiao ◽  
Zhe Yang ◽  
Weiming Cheng ◽  
Hao Tong ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Magnetic Transition ◽  
Metallic Phase

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

2017 ◽  
Author(s):  
David Gonzalez-Nino ◽  
Lauren M. Boteler ◽  
Nicholas R. Jankowski ◽  
Dimeji Ibitayo ◽  
Pedro O. Quintero
Keyword(s):  
Silicon Nitride ◽  
Heat Source ◽  
Phase Change ◽  
Phase Change Materials ◽  
Cooling System ◽  
Thermal Response ◽  
Metallic Phase ◽  
Maximum Temperature ◽  
Before And After ◽  
Power Loading

Metallic phase change materials (PCMs) have been demonstrated as an excellent alternative to act as a passive cooling system for pulse power applications. The possibility of integrating metallic PCMs, directly on top of a heat source, reducing the thermal resistance between the device and the cooling solution, could result in a significant improvement in thermal management for transient applications. However, the effectiveness of this method of implementation will depend on the quality of the interface between the metallic PCM and the heat source. For this work, a metallic PCM (49Bi/18Pb/12Sn/21In-Bi/Pb/Sn/In for simplicity) was placed directly on top of a device that has a layer of silicon nitride on the top. The device was pulsed with powers of 40W – 160W (84W/cm2 – 338W/cm2) with a 20 ms duration. After reaching the maximum power, the device was pulsed for a second cycle, and the temperature profiles were compared. Micrographical inspections, at the interlayer between the silicon nitride and metallic PCM, were performed before and after the pulses and compared. A maximum temperature of ≈20–25% higher was observed in the performance (at 80W) after pulse cycling. A visual inspection at the mating surfaces, between the metallic PCM and device, showed a clear difference between the contact surfaces before and after pulses. Significant voiding at the PCM interfacial layer was observed after cyclic loading which is believed to be the cause of the recorded increment in maximum temperature.

Selection of compatible metallic phase change materials and containers for thermal storage applications

2020 ◽  
Vol 32 ◽  
pp. 101927
Author(s):  
Anthony Joseph Rawson ◽  
Werner Kraft ◽  
Tina Gläsel ◽  
Florian Kargl
Keyword(s):  
Phase Change ◽  
Phase Change Materials ◽  
Thermal Storage ◽  
Metallic Phase ◽  
Selection Of

Experimental evaluation of metallic phase change materials for thermal transient mitigation

2018 ◽  
Vol 116 ◽  
pp. 512-519 ◽  
Author(s):  
David Gonzalez-Nino ◽  
Lauren M. Boteler ◽  
Dimeji Ibitayo ◽  
Nicholas R. Jankowski ◽  
Damian Urciuoli ◽  
...  
Keyword(s):  
Phase Change ◽  
Experimental Evaluation ◽  
Phase Change Materials ◽  
Metallic Phase ◽  
Thermal Transient

scholarly journals High Temperature Thermal Energy Storage Utilizing Metallic Phase Change Materials and Metallic Heat Transfer Fluids

2013 ◽  
Vol 135 (3) ◽  
Author(s):  
Johannes P. Kotzé ◽  
Theodor W. von Backström ◽  
Paul J. Erens
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Energy Storage ◽  
Phase Change ◽  
Thermal Energy ◽  
Thermal Energy Storage ◽  
Phase Change Materials ◽  
Metallic Phase ◽  
High Thermal Conductivity ◽  
Heat Transfer Fluids

Cost and volume savings are some of the advantages offered by the use of latent heat thermal energy storage (TES). Metallic phase change materials (PCMs) have high thermal conductivity, which relate to high charging and discharging rates in TES system, and can operate at temperatures exceeding 560 °C. In the study, a eutectic aluminium–silicon alloy, AlSi12, is identified as a good potential PCM. AlSi12 has a melting temperature of 577 °C, which is above the working temperature of regular heat transfer fluids (HTFs). The eutectic sodium–potassium alloy (NaK) is identified as an ideal HTF in a storage system that uses metallic PCMs. A concept is presented that integrates the TES-unit and steam generator into one unit. As NaK is highly reactive with water, the inherently high thermal conductivity of AlSi12 is utilized in order to create a safe concept. As a proof of concept, a steam power-generating cycle was considered that is especially suited for a TES using AlSi12 as PCM. The plant was designed to deliver 100 MW with 15 h of storage. Thermodynamic and heat transfer analysis showed that the concept is viable. The analysis indicated that the cost of the AlSi12 storage material is 14.7 US$per kWh of thermal energy storage.

scholarly journals Evaluation of thermal control performance of phase change materials for thermal shock protection of electronics

2021 ◽  
Vol 2045 (1) ◽  
pp. 012032
Author(s):  
X H Yang ◽  
C H Huang ◽  
H B Ke ◽  
L Chen ◽  
P Song
Keyword(s):  
Phase Change ◽  
Thermal Shock ◽  
Phase Change Materials ◽  
Thermal Control ◽  
Metallic Phase ◽  
Control Performance ◽  
Modeling And Analysis ◽  
Significant Difference ◽  
Shock Protection ◽  
Solid Liquid

Abstract Phase change materials have important application value in the fields of heat storage, cold storage, and thermal shock protection of electronic chips. In particular, in the field of chip thermal shock protection, phase change materials can use the solid-liquid phase change process to absorb a large amount of latent heat, thereby suppressing the temperature rise of the chip and preventing it from overheating. At present, there are mainly three types of common phase change materials: organic, inorganic and metallic phase change materials. There exists significant difference in the thermophysical properties of the three types of materials, and their thermal control performance also have their own characteristics. This paper sorts out the main thermophysical data of the three types of phase change materials. Through theoretical modeling and analysis, the thermal control performance of these materials is quantitatively evaluated and compared. For typical chip thermal shock conditions, the three types of phase change materials are compared, and their typical characteristics are intuitively displayed. The research results can serve as value reference for the development of phase change thermal control technology for chips.

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