Peri-implant bone formation of non-thermal atmospheric pressure plasma-treated zirconia implants with different surface roughness in rabbit tibiae

2013 ◽  
Vol 25 (5) ◽  
pp. 573-579 ◽  
Author(s):  
Won-Jun Shon ◽  
Shin Hye Chung ◽  
Hong-Kyun Kim ◽  
Geum-Jun Han ◽  
Byeong-Hoon Cho ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Bone Formation ◽  
Atmospheric Pressure ◽  
Atmospheric Pressure Plasma ◽  
Pressure Plasma ◽  
Zirconia Implants

scholarly journals Atmospheric Pressure Plasma Processing of an Optical Sinusoidal Grid

Micromachines ◽  
2019 ◽  
Vol 10 (12) ◽  
pp. 828 ◽  
Author(s):  
Duo Li ◽  
Na Li ◽  
Xing Su ◽  
Peng Ji ◽  
Bo Wang
Keyword(s):  
Surface Roughness ◽  
Atmospheric Pressure ◽  
Plasma Processing ◽  
Atmospheric Pressure Plasma ◽  
Degree Of Freedom ◽  
Generation Mechanism ◽  
Surface Generation ◽  
Pressure Plasma ◽  
Simulation And Experiment ◽  
Grid Surface

Sinusoidal grid with nanometric precision is adopted as a surface encoder to measure multiple degree-of-freedom motions. This paper proposes the atmospheric pressure plasma processing (APPP) technique to fabricate an optical sinusoidal grid surface. The characteristics of removal function and surface generation mechanism are firstly presented. Both simulation and experiment validate the effectiveness of APPP to fabricate a sinusoidal grid surface with nanometric precision. Post mechanical polishing experiments show that APPP features can be well maintained while the surface roughness is greatly reduced to meet the optical requirement.

Effect of Surface Roughness in Model and Fresh Fruit Systems on Microbial Inactivation Efficacy of Cold Atmospheric Pressure Plasma

2017 ◽  
Vol 80 (8) ◽  
pp. 1337-1346 ◽  
Author(s):  
Siddharth Bhide ◽  
Deepti Salvi ◽  
Donald W. Schaffner ◽  
Mukund V. Karwe
Keyword(s):  
Surface Roughness ◽  
Atmospheric Pressure ◽  
Food Systems ◽  
Atmospheric Pressure Plasma ◽  
Microbial Inactivation ◽  
Fresh Fruit ◽  
Fruit Peel ◽  
Pressure Plasma ◽  
Cold Atmospheric Pressure Plasma ◽  
The Difference

ABSTRACT This study investigates the efficacy of cold atmospheric pressure plasma (CAPP) on microbial inactivation as influenced by surface roughness of two types of surfaces: sandpaper and fresh fruit peel. Different grits of closed-coat sandpaper were selected, with their roughness (Pq) values ranging from 6 to 16 μm. Apple, orange, and cantaloupe peels were selected for roughness values that were similar to the sandpapers. The sandpapers and the fruit peel surfaces were spot inoculated with Enterobacter aerogenes (109 CFU/63.64 cm2) and exposed to CAPP for 492 s. Similar microbial enumeration techniques were used for both systems to quantify the microbial inactivation. The smoothest sandpaper showed a 0.52-log higher inactivation of E. aerogenes (2.08 log CFU/63.64 cm2 sandpaper surface inactivation) than did the roughest sandpaper (1.56 log CFU/63.64 cm2 sandpaper surface inactivation), and the difference was statistically significant (P < 0.05). The smoothest fresh fruit peel surface (apple) showed a 1.25-log higher inactivation of the microorganism (1.86 log CFU/63.64 cm2 fruit peel surface inactivation) than did the roughest fresh fruit peel surface (cantaloupe; 0.61 log CFU/63.64 cm2 fruit peel surface inactivation), and the difference was statistically significant (P < 0.05). As the surface roughness increased, microbial inactivation efficacy of CAPP decreased for both systems. The results from sandpaper show that, in a scenario in which the surface roughness was the only parameter of difference, the microbial inactivation efficacy of CAPP decreased with increasing surface roughness. The results from fruit surfaces show high variability and were not directly predictable from the sandpaper data. This suggests that the microbial inactivation efficacy of CAPP in real-world food systems, such as on fresh fruit peels, is affected by factors in addition to surface roughness.

Change in Surface Morphology of Si (100) Wafer after Oxidation with Atmospheric-Pressure Plasma

2016 ◽  
Vol 723 ◽  
pp. 242-246
Author(s):  
Hiroyasu Takei ◽  
Satoshi Kurio ◽  
Satoshi Matsuyama ◽  
Kazuto Yamauchi ◽  
Yasuhisa Sano
Keyword(s):  
Surface Roughness ◽  
Atmospheric Pressure ◽  
Oxidation Rate ◽  
Surface Profile ◽  
Atmospheric Pressure Plasma ◽  
Oxidation Time ◽  
Plasma Oxidation ◽  
Electrode Arrays ◽  
Pressure Plasma ◽  
Electrode Voltage

Modern surface processing of semiconductors or oxide materials requires highly precise temporal control of each processing step. In addition, large wafers must be processed quickly for high throughput. We have developed a numerically controlled sacrificial oxidation method with atmospheric-pressure plasma using electrode arrays. In this method, we oxidized the surface of a wafer with atmospheric-pressure plasma applied precisely by an electrode array, and then dipped the wafer in HF solution to remove the surface oxide layer. The plasma process time can be controlled independently at each electrode area. The oxidation rate and surface profile of the treated wafer are crucial for precision processing. We investigated the oxidation rate of atmospheric-pressure plasma oxidation by spectroscopic ellipsometry and examined the surface morphologies of untreated and treated wafers by atomic force microscopy. The surface profile smoothness correlated with the plasma oxidation time and electrode voltage during oxidation. The surface roughness tended to increase when the sample was oxidized for longer times with higher electrode voltage. This correlation between surface roughness and oxidation time resembled the results of Si/SiO2 interfacial roughness in the case of thermal oxidation. In the plasma sacrificial oxidation process, the increase of surface roughness at the Si/SiO2 interface by plasma oxidation must be considered.

Ultrasonic Wave Detection in Atmospheric Pressure Plasma Using Fraunhofer Diffraction Effect

PIERS Online ◽  
2010 ◽  
Vol 6 (7) ◽  
pp. 636-639
Author(s):  
Toshiyuki Nakamiya ◽  
Fumiaki Mitsugi ◽  
Shota Suyama ◽  
Tomoaki Ikegami ◽  
Yoshito Sonoda ◽  
...  
Keyword(s):  
Ultrasonic Wave ◽  
Atmospheric Pressure ◽  
Atmospheric Pressure Plasma ◽  
Diffraction Effect ◽  
Fraunhofer Diffraction ◽  
Wave Detection ◽  
Pressure Plasma

scholarly journals Atmospheric Pressure Plasma Deposition of TiO2: A Review

Materials ◽  
2020 ◽  
Vol 13 (13) ◽  
pp. 2931
Author(s):  
Soumya Banerjee ◽  
Ek Adhikari ◽  
Pitambar Sapkota ◽  
Amal Sebastian ◽  
Sylwia Ptasinska
Keyword(s):  
Atmospheric Pressure ◽  
Gas Flow ◽  
Plasma Deposition ◽  
Atmospheric Pressure Plasma ◽  
Cost Savings ◽  
Historical Background ◽  
Pressure Plasma ◽  
Wide Range ◽  
The Status ◽  
Deposition Techniques

Atmospheric pressure plasma (APP) deposition techniques are useful today because of their simplicity and their time and cost savings, particularly for growth of oxide films. Among the oxide materials, titanium dioxide (TiO2) has a wide range of applications in electronics, solar cells, and photocatalysis, which has made it an extremely popular research topic for decades. Here, we provide an overview of non-thermal APP deposition techniques for TiO2 thin film, some historical background, and some very recent findings and developments. First, we define non-thermal plasma, and then we describe the advantages of APP deposition. In addition, we explain the importance of TiO2 and then describe briefly the three deposition techniques used to date. We also compare the structural, electronic, and optical properties of TiO2 films deposited by different APP methods. Lastly, we examine the status of current research related to the effects of such deposition parameters as plasma power, feed gas, bias voltage, gas flow rate, and substrate temperature on the deposition rate, crystal phase, and other film properties. The examples given cover the most common APP deposition techniques for TiO2 growth to understand their advantages for specific applications. In addition, we discuss the important challenges that APP deposition is facing in this rapidly growing field.

Effects of iodine dopant on atmospheric pressure plasma polymerized pyrrole in remote and coupling methods

2018 ◽  
Vol 677 (1) ◽  
pp. 135-142
Author(s):  
Dong Ha Kim ◽  
Choon-Sang Park ◽  
Eun Young Jung ◽  
Bhum Jae Shin ◽  
Jae Young Kim ◽  
...  
Keyword(s):  
Atmospheric Pressure ◽  
Atmospheric Pressure Plasma ◽  
Pressure Plasma ◽  
Coupling Methods
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