An ultra low power RFID sensor platform for launchers applications

Author(s):  
Jean-Marc Collignon Picdi ◽  
Badr Rmili
2015 ◽  
Vol 50 (5) ◽  
pp. 1263-1274 ◽  
Author(s):  
Dong-Woo Jee ◽  
Dennis Sylvester ◽  
David Blaauw ◽  
Jae-Yoon Sim

2020 ◽  
Vol 2020 (1) ◽  
pp. 000181-000184
Author(s):  
F.R. Libsch ◽  
S.W. Bedell ◽  
B.C. Webb ◽  
A. Paidimarri

Abstract This paper discusses some design and implementation issues related to GaN micro-LED (μLED) incorporated into the heterogeneous packaging of IBM’s smart and secure sensor platform. For cost effective μLEDs, the sapphire substrate needs to be singulated reliably and with minimum kerf perimeter, be ultra-clean and smooth to allow back side emission without scattering, and high yielding front side flip chip bonding with 20μm C4s on 40μm pitch. The GaN μLEDs are design for low voltage/low power operation with an emission area of 20μm × 20μm with critical current density of ~10nA/μm2. Power and downlink data is delivered to the system via optical energy harvesting by on-silicon carrier photovoltaics and communication photodiode, respectively. Optical amplitude modulated uplink communication by heterogeneous packaging of the GaN μLED with a 14nm CMOS smart chip will be detailed and demonstrated in presentation.


2020 ◽  
Vol 51 ◽  
pp. 296-301
Author(s):  
Tristan Caroff ◽  
Sebastien Brulais ◽  
Adrien Faucon ◽  
Axel Boness ◽  
Anne Sanz Arrizabalaga ◽  
...  

Author(s):  
M. Tanevski ◽  
A. Boegli ◽  
P.-A. Farine ◽  
F. Merli ◽  
J.-F. Zurcher ◽  
...  

Author(s):  
Young-Jun Hong ◽  
Joonseong Kang ◽  
Seong Joong Kim ◽  
Sang Joon Kim ◽  
Ui-Kun Kwon

2016 ◽  
Vol 136 (11) ◽  
pp. 1555-1566 ◽  
Author(s):  
Jun Fujiwara ◽  
Hiroshi Harada ◽  
Takuya Kawata ◽  
Kentaro Sakamoto ◽  
Sota Tsuchiya ◽  
...  

2010 ◽  
Vol E93-C (6) ◽  
pp. 785-795
Author(s):  
Sung-Jin KIM ◽  
Minchang CHO ◽  
SeongHwan CHO
Keyword(s):  
Rfid Tag ◽  

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