Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration

2012 ◽  
Author(s):  
Kazuyuki Hozawa ◽  
Futoshi Furuta ◽  
Yuko Hanaoka ◽  
Mayu Aoki ◽  
Kenichi Osada ◽  
...  
Keyword(s):  
Data Transmission ◽  
Three Dimensional ◽  
Chip Data

scholarly journals An Energy-Aware Data Transmission Scheme under the Guarantee of Reliability for 3D WSNs

2020 ◽  
Vol 2020 ◽  
pp. 1-16
Author(s):  
J. H. Zhang ◽  
Z. X. Yi ◽  
C. Y. Peng ◽  
Shahid Hussain
Keyword(s):  
Energy Consumption ◽  
Data Collection ◽  
Data Transmission ◽  
Dimensional Space ◽  
Three Dimensional ◽  
Transmission Scheme ◽  
Energy Aware ◽  
Shortest Path Routing ◽  
Transmission Reliability ◽  
Three Dimensional Space

Three-dimensional wireless sensor networks (3D WSNs) play an important role to provide data collection services for Internet of things (IoT) in the real applications. However, many of the existing WSN data collection researches are based on a relatively simple linear or plane network model. The three-dimensional space problems are simplified to two-dimensional plane, which limits the applicability. In this paper, the data collection in 3D WSN is studied. In the three-dimensional space, we firstly analyze the data loads, energy consumption, and end-to-end (E2E) delay of each node when the network is following the shortest path routing. The mathematical analysis of data loads and E2E delay of each node are presented. Based on the analysis of data loads and energy consumption, an energy-ware data transmission scheme is proposed to achieve the trade-off optimization between the E2E delay and network lifetime under the guarantee of the transmission reliability. The key point of the proposed scheme is to make fully use of the unbalanced energy consumption of the 3D WSN. The performance of the proposed scheme is discussed, analyzed, and evaluated. The theoretical analysis and simulation results show that the E2E network delay and energy efficiency can be improved under the constraint of transmission reliability.

scholarly journals Magnetic Positioning Technique Integrated with Near-Field Communication for Wireless EV Charging

Energies ◽  
2020 ◽  
Vol 13 (5) ◽  
pp. 1081 ◽  
Author(s):  
Zhongnan Qian ◽  
Rui Yan ◽  
Zeqian Cheng ◽  
Jiande Wu ◽  
Xiangning He
Keyword(s):  
Relative Position ◽  
Data Transmission ◽  
Power Efficiency ◽  
Near Field ◽  
Three Dimensional ◽  
Secondary Coil ◽  
Power Transfer ◽  
Electric Vehicle Charging ◽  
Position Detection ◽  
Positioning Method

For wireless electric vehicle charging, the relative position of the primary and secondary coils has significant impacts on the transferred power, efficiency and leakage magnetic flux. In this paper, a magnetic positioning method using simultaneous power and data transmission (SWPDT) is proposed for power coil alignment. Four signal coils are installed on the primary coil to detect the secondary coil position. By measuring the positioning signal amplitudes from the four signal coils, the power coil relative position can be obtained. Moreover, all the communication needed in the positioning process can be satisfied well by SWPDT technology, and no extra radio frequency (RF) communication hardware is needed. The proposed positioning method can work properly both in power transfer online condition and in power transfer offline condition. Thus, a highly integrated wireless charging system is achieved, which features simultaneous power transfer, data transmission and position detection. A positioning experimental setup is built to verify the proposed method. The experimental results demonstrate that the positioning resolution can be maintained no lower than 1 cm in a 1060 mm × 900 mm elliptical region for a pair of 510 mm × 410 mm rectangular power coils. The three-dimensional positioning accuracy achieves up to 1 cm.

Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI

2012 ◽  
Vol 33 (2) ◽  
pp. 221-223 ◽  
Author(s):  
Akihiro Noriki ◽  
Kangwook Lee ◽  
Jicheol Bea ◽  
Takafumi Fukushima ◽  
Tetsu Tanaka ◽  
...  
Keyword(s):  
Data Transmission ◽  
High Speed ◽  
Three Dimensional ◽  
Silicon Photonic ◽  
High Speed Data ◽  
Speed Data Transmission

Three-dimensional PAC video codec for wireless data transmission

2000 ◽  
Vol 10 (8) ◽  
pp. 1455-1470
Author(s):  
Kuei-Ann Wen ◽  
An-Yi Chen ◽  
Yin-Jin Lan ◽  
Jun-Lin Lin ◽  
Chia-Huang Lin
Keyword(s):  
Data Transmission ◽  
Three Dimensional ◽  
Video Codec ◽  
Wireless Data ◽  
Wireless Data Transmission

scholarly journals WDM-compatible multimode optical switching system-on-chip

Nanophotonics ◽  
2019 ◽  
Vol 8 (5) ◽  
pp. 889-898 ◽  
Author(s):  
Hao Jia ◽  
Shanglin Yang ◽  
Ting Zhou ◽  
Sizhu Shao ◽  
Xin Fu ◽  
...  
Keyword(s):  
Data Transmission ◽  
High Speed ◽  
Optical Switching ◽  
System On Chip ◽  
Optical Modulator ◽  
Switching System ◽  
Large Capacity ◽  
Chip Data ◽  
Data Throughput ◽  
On Chip

AbstractThe development of optical interconnect techniques greatly expands the communication bandwidth and decreases the power consumption at the same time. It provides a prospective solution for both intra-chip and inter-chip links. Herein reported is an integrated wavelength-division multiplexing (WDM)-compatible multimode optical switching system-on-chip (SoC) for large-capacity optical switching among processors. The interfaces for the input and output of the processor signals are electrical, and the on-chip data transmission and switching process are optical. It includes silicon-based microring optical modulator arrays, mode multiplexers/de-multiplexers, optical switches, microring wavelength de-multiplexers and germanium-silicon high-speed photodetectors. By introducing external multi-wavelength laser sources, the SoC achieved the function of on-chip WDM and mode-division multiplexing (MDM) hybrid-signal data transmission and switching on a standard silicon photonics platform. As a proof of concept, signals with a 25 Gbps data rate are implemented on each microring modulator of the fabricated SoC. We illustrated 25 × 3 × 2 Gbps on-chip data throughput with two-by-two multimode switching functionality through implementing three wavelength-channels and two mode-channel hybrid-multiplexed signals for each multimode transmission waveguide. The architecture of the SoC is flexible to scale, both for the number of supported processors and the data throughput. The demonstration paves the way to a large-capacity multimode optical switching SoC.

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