2D Affine and Projective Shape Analysis

2014 ◽  
Vol 36 (5) ◽  
pp. 998-1011 ◽  
Author(s):  
Darshan Bryner ◽  
Eric Klassen ◽  
Huiling Le ◽  
Anuj Srivastava
Keyword(s):  
Shape Analysis ◽  
Projective Shape

Projective Shape Analysis

1999 ◽  
Vol 8 (2) ◽  
pp. 143-168 ◽  
Author(s):  
Colin R. Goodall ◽  
Kanti V. Mardia
Keyword(s):  
Shape Analysis ◽  
Projective Shape

Projective Shape Analysis

1999 ◽  
Vol 8 (2) ◽  
pp. 143 ◽  
Author(s):  
Colin R. Goodall ◽  
Kanti V. Mardia
Keyword(s):  
Shape Analysis ◽  
Projective Shape

Projective shape analysis of contours and finite 3D configurations from digital camera images

2016 ◽  
Vol 57 (4) ◽  
pp. 1017-1040 ◽  
Author(s):  
Victor Patrangenaru ◽  
Robert Paige ◽  
K. David Yao ◽  
Mingfei Qiu ◽  
David Lester
Keyword(s):  
Shape Analysis ◽  
Digital Camera ◽  
Projective Shape

scholarly journals The one- and multi-sample problem for functional data with application to projective shape analysis

2008 ◽  
Vol 99 (5) ◽  
pp. 815-833 ◽  
Author(s):  
A. Munk ◽  
R. Paige ◽  
J. Pang ◽  
V. Patrangenaru ◽  
F. Ruymgaart
Keyword(s):  
Shape Analysis ◽  
Functional Data ◽  
Sample Problem ◽  
The One ◽  
Projective Shape

3D CT Cephalometry of Plagiocephaly: Asymmetry and Shape Analysis

2005 ◽  
Author(s):  
David Netherway ◽  
Amanda Abbott ◽  
Nadim Gulamhuseinwala ◽  
Karen McGlaughlin ◽  
Peter Anderson ◽  
...  
Keyword(s):  
Shape Analysis ◽  
3D Ct

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

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