High-performance air-gap transmission lines and inductors for millimeter-wave applications

2002 ◽  
Vol 50 (12) ◽  
pp. 2850-2855 ◽  
Author(s):  
Inho Jeong ◽  
Seong-Ho Shin ◽  
Ju-Hyun Go ◽  
Joong-Soo Lee ◽  
Choong-Mo Nam ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Transmission Lines ◽  
High Performance ◽  
Air Gap

Flexible and miniaturized power divider

2015 ◽  
Vol 8 (3) ◽  
pp. 547-557 ◽  
Author(s):  
François Burdin ◽  
Florence Podevin ◽  
Philippe Ferrari
Keyword(s):  
Millimeter Wave ◽  
Transmission Lines ◽  
High Performance ◽  
Size Reduction ◽  
Input Port ◽  
Power Divider ◽  
Proof Of Concept ◽  
Millimeter Wave Range ◽  
Measurement Results ◽  
Wave Range

A new flexible and miniaturized power divider (PD), based on the Wilkinson PD topology, is carried out in this paper. Flexibility and size reduction are achieved simultaneously thanks to both an open-stub loading the input port and additional transmission lines (TLines) connecting the output ports to the isolation resistance. Design equations and rules are given. As a proof-of-concept, two PDs working at 2.45 GHz were fabricated and measured. Then, on the basis of the previous developments, a 1:4 power-dividing feeding network was realized. It highlights the high performance and flexibility of the proposed PD. Agreement between simulation and measurement results is very good, for PDs as well as for the feeding network, thus validating the proposed approach. This concept is straightforward to be applied at higher frequencies, in particular in the millimeter-wave range on CMOS technologies, where flexibility in the choice of the TLines characteristic impedances and size reduction are mandatory.

On-Chip High-Performance Millimeter-Wave Transmission Lines on Locally Grown Porous Silicon Areas

2011 ◽  
Vol 58 (11) ◽  
pp. 3720-3724 ◽  
Author(s):  
Hamza Issa ◽  
Philippe Ferrari ◽  
Emmanouel Hourdakis ◽  
Androula G. Nassiopoulou
Keyword(s):  
Porous Silicon ◽  
Millimeter Wave ◽  
Transmission Lines ◽  
High Performance ◽  
Wave Transmission ◽  
On Chip ◽  
Locally Grown

scholarly journals A RF Redundant TSV Interconnection for High Resistance Si Interposer

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 169
Author(s):  
Mengcheng Wang ◽  
Shenglin Ma ◽  
Yufeng Jin ◽  
Wei Wang ◽  
Jing Chen ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
High Frequency ◽  
High Performance ◽  
Rapid Development ◽  
Coplanar Waveguide ◽  
Equivalent Circuit Model ◽  
High Resistivity ◽  
Performance Requirements ◽  
Wave Radar ◽  
Interconnect Design

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio frequency system-in-package (RF SIP) substrates. This paper presents a redundant TSV interconnect design for high resistivity Si interposers for millimeter-wave applications. To verify its feasibility, a set of test structures capable of working at millimeter waves are designed, which are composed of three pieces of CPW (coplanar waveguide) lines connected by single TSV, dual redundant TSV, and quad redundant TSV interconnects. First, HFSS software is used for modeling and simulation, then, a modified equivalent circuit model is established to analysis the effect of the redundant TSVs on the high-frequency transmission performance to solidify the HFSS based simulation. At the same time, a failure simulation was carried out and results prove that redundant TSV can still work normally at 44 GHz frequency when failure occurs. Using the developed TSV process, the sample is then fabricated and tested. Using L-2L de-embedding method to extract S-parameters of the TSV interconnection. The insertion loss of dual and quad redundant TSVs are 0.19 dB and 0.46 dB at 40 GHz, respectively.

Impact of technology dispersion on slow-wave high performance shielded CPW transmission lines characteristics

2010 ◽  
Vol 52 (12) ◽  
pp. 2786-2789 ◽  
Author(s):  
A.-L. Franc ◽  
D. Kaddour ◽  
H. Issa ◽  
E. Pistono ◽  
N. Corrao ◽  
...  
Keyword(s):  
Slow Wave ◽  
Transmission Lines ◽  
High Performance ◽  
Impact Of Technology
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