Contactless Test Access Mechanism for TSV-Based 3-D ICs Utilizing Capacitive Coupling
2016 ◽
Vol 65
(1)
◽
pp. 88-95
◽
2011 ◽
Vol 131
(6)
◽
pp. 858-859
◽
2017 ◽
Vol 2
(2)
◽
pp. 15-19
◽
Keyword(s):
2016 ◽
Vol 52
(5)
◽
pp. 4269-4280
◽
Keyword(s):