Modeling Studies on the Development of a System for Real-Time Magnetic-Field Imaging of Steel Reinforcing Bars Embedded Within Reinforced Concrete

2008 ◽  
Vol 57 (3) ◽  
pp. 571-576 ◽  
Author(s):  
Sung Quek ◽  
D. Benitez ◽  
P. Gaydecki ◽  
V. Torres
Keyword(s):  
Magnetic Field ◽  
Reinforced Concrete ◽  
Real Time ◽  
Reinforcing Bars ◽  
Modeling Studies ◽  
Magnetic Field Imaging ◽  
Field Imaging

A multi-magneto-inductive sensor array system for real-time magnetic field imaging of ferromagnetic targets

2021 ◽  
Vol 92 (3) ◽  
pp. 035113
Author(s):  
Huan Liu ◽  
Changfeng Zhao ◽  
Xiaobin Wang ◽  
Zehua Wang ◽  
Jian Ge ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Real Time ◽  
Sensor Array ◽  
Inductive Sensor ◽  
Magnetic Field Imaging ◽  
Field Imaging

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

2017 ◽  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Two Dimensions ◽  
Analysis Tool ◽  
Active Device ◽  
Current Path ◽  
3D Packaging ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

scholarly journals Magnetic field imaging of a model electric motor using polarized pulsed neutrons at J-PARC/MLF

2017 ◽  
Vol 862 ◽  
pp. 012008 ◽  
Author(s):  
K Hiroi ◽  
T Shinohara ◽  
H Hayashida ◽  
J D Parker ◽  
K Oikawa ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Electric Motor ◽  
Magnetic Field Imaging ◽  
Field Imaging

scholarly journals Comparison of magnetic field imaging (MFI) and magnetic field simulation of silicon solar cells

2019 ◽  
Author(s):  
Ulli Zeller ◽  
Dominik Lausch ◽  
Matthias Pander ◽  
Kai Kaufmann ◽  
Sebastian Slaby ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Solar Cells ◽  
Silicon Solar Cells ◽  
Magnetic Field Simulation ◽  
Field Simulation ◽  
Magnetic Field Imaging ◽  
Field Imaging

Evaluation of the Quality of Solder Joints Within Silicon Solar Modules Using Magnetic Field Imaging (MFI)

2020 ◽  
Author(s):  
Kai Kaufmann ◽  
Dominik Lausch ◽  
Chia-Mei Lin ◽  
Maik Rudolph ◽  
Daniel Hahn ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Solder Joints ◽  
Magnetic Field Imaging ◽  
Field Imaging
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