Quality enhancement of reconfigurable multichip module systems by redundancy utilization

Minsu Choi; N. Park; F. Lombardi; V. Piuri

doi:10.1109/tim.2002.803305

Quality enhancement of reconfigurable multichip module systems by redundancy utilization

IEEE Transactions on Instrumentation and Measurement ◽

10.1109/tim.2002.803305 ◽

2002 ◽

Vol 51 (4) ◽

pp. 740-749 ◽

Cited By ~ 2

Author(s):

Minsu Choi ◽

N. Park ◽

F. Lombardi ◽

V. Piuri

Keyword(s):

Multichip Module ◽

Quality Enhancement ◽

Module Systems

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Quality enhancement of reconfigurable multichip module systems by redundant utilization

IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics (Cat. No.01CH 37188) ◽

10.1109/imtc.2001.928813 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Choi ◽

N. Park ◽

F. Lombardi ◽

V. Piuri

Keyword(s):

Multichip Module ◽

Quality Enhancement ◽

Module Systems

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Modeling testing-strategies for yield enhancement of multichip module systems

IEEE Transactions on Reliability ◽

10.1109/24.589945 ◽

1997 ◽

Vol 46 (2) ◽

pp. 184-192

Author(s):

Sungsoo Kim ◽

N. Park ◽

P. Lombardi

Keyword(s):

Yield Enhancement ◽

Multichip Module ◽

Testing Strategies ◽

Module Systems

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Modelling intermediate tests for fault-tolerant multichip module systems

Microelectronics Reliability ◽

10.1016/s0026-2714(97)87776-1 ◽

1997 ◽

Vol 37 (3) ◽

pp. 530-531

Keyword(s):

Fault Tolerant ◽

Multichip Module ◽

Module Systems

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Analysis of stratified testing for multichip module systems

IEEE Transactions on Reliability ◽

10.1109/24.994924 ◽

2002 ◽

Vol 51 (1) ◽

pp. 100-110 ◽

Cited By ~ 4

Author(s):

N. Park ◽

F. Lombardi

Keyword(s):

Multichip Module ◽

Module Systems

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Quality-effective repair of multichip module systems

Journal of Systems Architecture ◽

10.1016/s1383-7621(01)00038-8 ◽

2002 ◽

Vol 47 (10) ◽

pp. 883-900 ◽

Cited By ~ 3

Author(s):

N. Park ◽

F. Meyer ◽

F. Lombardi

Keyword(s):

Multichip Module ◽

Module Systems

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Yield analysis of fault-tolerant multichip module systems for massively parallel computing

Proceedings IEEE International Conference on Wafer Scale Integration (ICWSI) ◽

10.1109/icwsi.1995.515465 ◽

2002 ◽

Author(s):

Sungsoo Kim ◽

F. Lombardi

Keyword(s):

Parallel Computing ◽

Fault Tolerant ◽

Massively Parallel ◽

Multichip Module ◽

Yield Analysis ◽

Massively Parallel Computing ◽

Module Systems

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Modeling quality reduction of multichip module systems due to uneven fault-coverage and imperfect diagnosis

Proceedings. 1996 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems ◽

10.1109/dftvs.1996.572022 ◽

2002 ◽

Cited By ~ 8

Author(s):

N. Park ◽

F. Lombardi ◽

Sungsoo Kim

Keyword(s):

Fault Coverage ◽

Multichip Module ◽

Module Systems

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Smart-substrate multichip-module systems

IEEE Design & Test of Computers ◽

10.1109/54.282446 ◽

1994 ◽

Vol 11 (2) ◽

pp. 64-73 ◽

Cited By ~ 16

Author(s):

W. Maly ◽

D.B.I. Feltham ◽

A.E. Gattiker ◽

M.D. Hobaugh ◽

K. Backus ◽

...

Keyword(s):

Multichip Module ◽

Module Systems

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Stratified testing of multichip module systems under uneven known-good-yield

Proceedings 1999 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (EFT'99) ◽

10.1109/dftvs.1999.802885 ◽

2003 ◽

Cited By ~ 4

Author(s):

N. Park ◽

F. Lombardi

Keyword(s):

Good Yield ◽

Multichip Module ◽

Module Systems

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Modeling intermediate tests for fault-tolerant multichip module systems

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.404102 ◽

1995 ◽

Vol 18 (3) ◽

pp. 448-455

Author(s):

Sungsoo Kim ◽

F. Lombardi

Keyword(s):

Fault Tolerant ◽

Multichip Module ◽

Module Systems

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