Transient thermal analysis of SiC high power density inverter

2016 ◽  
Author(s):  
Arie Nawawi ◽  
Rejeki Simanjorang ◽  
Hui Chen Yang ◽  
Chin Foong Tong ◽  
Assel Sakanova ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Power Density ◽  
High Power ◽  
High Power Density ◽  
Transient Thermal Analysis ◽  
Transient Thermal

Thermal Analysis of High Power Density Laser Diode Stack Cooling Structure

2016 ◽  
Vol 37 (1) ◽  
pp. 81-87
Author(s):  
井红旗 JING Hong-qi ◽  
仲莉 ZHONG Li ◽  
倪羽茜 NI Yu-xi ◽  
张俊杰 ZHANG Jun-jie ◽  
刘素平 LIU Su-ping ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Power Density ◽  
Laser Diode ◽  
High Power ◽  
High Power Density

Thermal Analysis of Potted Litz Wire for High Power Density Aerospace Electric Machines

2019 ◽  
Author(s):  
Andrew Woodworth ◽  
William A. Sixel ◽  
Ryan Edwards ◽  
Ralph Jansen ◽  
Sean McCormick ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Power Density ◽  
High Power ◽  
Electric Machines ◽  
High Power Density

Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests

2013 ◽  
Vol 2013 (1) ◽  
pp. 000902-000907
Author(s):  
Gordon Elger ◽  
Shri Vishnu Kandaswamy ◽  
Robert Derix ◽  
Jürgen Wilde
Keyword(s):  
Thermal Analysis ◽  
Solder Joint ◽  
High Power ◽  
Test Method ◽  
Temperature Cycle ◽  
Electric Resistance ◽  
Transient Thermal Analysis ◽  
Open Contact ◽  
Long Lifetime ◽  
Transient Thermal

Light emitting diodes (LEDs) are today standard and mature light sources. They have several key advantages, like small size, low energy consumption and long lifetime. However, high reliability of the LED system is required to achieve long lifetime of the light source. Thermo-mechanical stress due to temperature cycle causes failure of electronic systems. The electronic component itself or the interconnect device, e.g. printed circuit board (PCB) might fail. In many cases, the weakest link is found to be the solder interconnect between package and the board. Cracking of the interconnect causes an open contact and the system fails. In this paper we compare the existing methods to investigate LED interconnect failures during temperature cycle tests like the simple “light-on-test”, electric resistance measurement and the shear test. We describe and introduce the transient thermal analysis as a measurement method. We present the first reliability data analysis with transient thermal analysis of ceramic high power LED packages on Al-IMS during air to air thermal shock test (−40°C to +125°C) and correlate it with cross sections. We demonstrate the sensitivity of the thermal analysis to detect solder joint failures of the assembly. We compare the results with electric resistance measurements and light on tests and show that the resolution is significantly higher compared to the methods applied today. The sensitivity of the method enables us to detect the crack in a solder joint much earlier than the final failure of the joint, i.e. the open contact.

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