Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards

The increased accuracy in high-speed positioning of the parallel robot effector in comparison with that of serial robots with a sequential structure is often the main reason for their use in various modern industries, such as the manufacture of printed circuit boards for microelectronics. However, despite the higher theoretical positioning accuracy, due to the kinematic structure of the parallel robot, in practice this characteristic largely depends on the accuracy of manufacturing individual elements of this mechanism, the most important of which are the gearboxes of the drives of its input pairs. A solution to the urgent problem of determining the effect of the manufacturing accuracy of planetary pinion gearboxes included in the drive of a five-link parallel robot on the positioning accuracy of its output link is proposed. A specific relationship has been determined between the grade of accuracy number of the gear part dimensions and the robot positioning accuracy. The unevenness of the positioning accuracy along the coordinate axes of its working area is revealed. It was found that near the area of certain robot positions the accuracy of its positioning drops sharply.

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Distortion of High-Speed Linear Pulses Caused by Transmission on Printed Circuit Boards

Modelling, Identification and Control ◽

10.2316/p.2017.848-018 ◽

2017 ◽

Author(s):

Milan Sigmund ◽

Lubomir Brancik

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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Advanced Build-up Materials for High Speed Transmission Application

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000305 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000305-000309 ◽

Cited By ~ 2

Author(s):

Shiro Tatsumi ◽

Shohei Fujishima ◽

Hiroyuki Sakauchi

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Transmission Loss ◽

Coefficient Of Thermal Expansion ◽

Strip Line ◽

Circuit Boards ◽

Additive Process ◽

Printed Circuit ◽

Low Dielectric ◽

Transmission Speed

Abstract Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. Our insulation materials are used in a semi-additive process (SAP) with low dielectric loss tangent, smooth resin surface after desmear, and good insulation reliability. Actually, the transmission loss of strip line substrates and Cu surface roughness impact on transmission loss were measured using our materials. Furthermore, low dielectric molding film with low coefficient of thermal expansion (CTE) and low Young's modulus are introduced.

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Investigation and Analysis of the Simultaneous Switching Noise in Power Distribution Network with Multi-Power Supplies of High Speed CMOS Circuits

Active and Passive Electronic Components ◽

10.1155/2017/9703029 ◽

2017 ◽

Vol 2017 ◽

pp. 1-10 ◽

Cited By ~ 1

Author(s):

Khaoula Ait Belaid ◽

Hassan Belahrach ◽

Hassan Ayad

Keyword(s):

Power Distribution ◽

High Speed ◽

Electromagnetic Coupling ◽

Distribution Network ◽

Switching Noise ◽

Power Distribution Network ◽

Vector Fitting ◽

Rational Function Approximation ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

The paper studies a simultaneous switching noise (SSN) in a power distribution network (PDN) with dual supply voltages and two cores. This is achieved by reducing the admittance matrix Y of the PDN then calculating frequency domain impedance with rational function approximation using vector fitting. This paper presents a method of computing the simultaneous switching noise through a switching current, whose properties and details are described. Thus, the results are discussed and performed using MATLAB and PSpice tools. It demonstrated that the presence of many cores in the same PCB influences the SSN due to electromagnetic coupling.

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Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards

Electronics ◽

10.3390/electronics8030299 ◽

2019 ◽

Vol 8 (3) ◽

pp. 299 ◽

Cited By ~ 1

Author(s):

Myunghoi Kim

Keyword(s):

Analytical Model ◽

High Speed ◽

Printed Circuit Boards ◽

Signal Transmission ◽

Circuit Boards ◽

Transmission Characteristics ◽

Differential Signal ◽

Printed Circuit ◽

Full Wave ◽

Differential Transmission

An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. Analytical expressions for the four-port impedance matrix of the CGP-EBG MTM-DTL are derived using coupled-line theory and a segmentation method. Converting the impedance matrix into mixed-mode scattering parameters enables obtaining common-mode noise suppression and differential signal transmission characteristics. The comprehensive evaluations of the CGP-EBG MTM-DTL using the proposed analytical model are also reported, which is validated by comparing mixed-mode scattering parameters Scc21 and Sdd21 with those obtained from full-wave simulations and measurements. The proposed analytical model provides a drastic reduction of computation time and accurate results compared to full-wave simulation.

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