scholarly journals Dark Current Blooming in Pinned Photodiode CMOS Image Sensors

2017 ◽  
Vol 64 (3) ◽  
pp. 1161-1166 ◽  
Author(s):  
Jean-Marc Belloir ◽  
Jean-Baptiste Lincelles ◽  
Alice Pelamatti ◽  
Clementine Durnez ◽  
Vincent Goiffon ◽  
...  
2014 ◽  
Vol 61 (1) ◽  
pp. 636-645 ◽  
Author(s):  
E. Martin ◽  
T. Nuns ◽  
J.-P. David ◽  
O. Gilard ◽  
J. Vaillant ◽  
...  

2012 ◽  
Vol 59 (4) ◽  
pp. 918-926 ◽  
Author(s):  
V. Goiffon ◽  
C. Virmontois ◽  
P. Magnan ◽  
P. Cervantes ◽  
S. Place ◽  
...  

2018 ◽  
Vol 65 (1) ◽  
pp. 92-100 ◽  
Author(s):  
Clementine Durnez ◽  
Vincent Goiffon ◽  
Cedric Virmontois ◽  
Serena Rizzolo ◽  
Alexandre Le Roch ◽  
...  

2016 ◽  
Vol 63 (4) ◽  
pp. 2183-2192 ◽  
Author(s):  
Jean-Marc Belloir ◽  
Vincent Goiffon ◽  
Cedric Virmontois ◽  
Philippe Paillet ◽  
Melanie Raine ◽  
...  

Sensors ◽  
2019 ◽  
Vol 19 (9) ◽  
pp. 2073 ◽  
Author(s):  
Kazunari Kurita ◽  
Takeshi Kadono ◽  
Satoshi Shigematsu ◽  
Ryo Hirose ◽  
Ryosuke Okuyama ◽  
...  

We developed silicon epitaxial wafers with high gettering capability by using hydrocarbon–molecular–ion implantation. These wafers also have the effect of hydrogen passivation on process-induced defects and a barrier to out-diffusion of oxygen of the Czochralski silicon (CZ) substrate bulk during Complementary metal-oxide-semiconductor (CMOS) device fabrication processes. We evaluated the electrical device performance of CMOS image sensor fabricated on this type of wafer by using dark current spectroscopy. We found fewer white spot defects compared with those of intrinsic gettering (IG) silicon wafers. We believe that these hydrocarbon–molecular–ion–implanted silicon epitaxial wafers will improve the device performance of CMOS image sensors.


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