scholarly journals Wireless Resonant Circuits Printed Using Aerosol Jet Deposition for MRI Catheter Tracking

2020 ◽  
Vol 67 (3) ◽  
pp. 876-882 ◽  
Author(s):  
Caroline D. Jordan ◽  
Bradford R. H. Thorne ◽  
Arjun Wadhwa ◽  
Aaron D. Losey ◽  
Eugene Ozhinsky ◽  
...  
2017 ◽  
Vol 123 ◽  
pp. S91-S92
Author(s):  
M. Kellermeier ◽  
B. Hofmann ◽  
V. Strnad ◽  
C. Bert

2015 ◽  
Vol 38 (7) ◽  
pp. 791-796 ◽  
Author(s):  
MOUSSA MANSOUR ◽  
MUHAMMAD R. AFZAL ◽  
SAMPATH GUNDA ◽  
JAYASREE PILLARISETTI ◽  
KEVIN HEIST ◽  
...  

2014 ◽  
Vol 6 (2) ◽  
pp. 149-158 ◽  
Author(s):  
Simon Kircher ◽  
Sascha Rolf ◽  
Gerhard Hindricks ◽  
Philipp Sommer

Author(s):  
Mari Nieves Velasco Forte ◽  
Kuberan Pushparajah ◽  
Tobias Schaeffter ◽  
Israel Valverde Perez ◽  
Kawal Rhode ◽  
...  

2015 ◽  
Vol 33 (16) ◽  
pp. 3426-3432
Author(s):  
Mohammad Hossein Mazaheri Kouhani ◽  
Berk Camli ◽  
Ahmet Uraz Cakaci ◽  
Emre Kusakci ◽  
Baykal Sarioglu ◽  
...  

2021 ◽  
pp. 1-1
Author(s):  
Xuan Thao Ha ◽  
Mouloud Ourak ◽  
Omar Al-Ahmad ◽  
Di Wu ◽  
Gianni Borghesan ◽  
...  

2011 ◽  
Vol 2011 (1) ◽  
pp. 001028-001032
Author(s):  
Michael J. O’Reilly ◽  
Jeff Leal ◽  
Suzette K. Pangrle ◽  
Kenneth Vartanian

Aerosol Jet deposition systems provide an evolutionary alternative to both wire bond and TSV technology. As part of the Vertical Interconnect Pillar (ViP™) process, the Aerosol Jet system prints high density three-dimensional (3D) interconnects enabling multi-function integrated circuits to be stacked and vertically interconnected in high performance System-in-Packages (SiP). The stacks can include two or more die, with a total height of ∼ 2 millimeters. The non-contact printing system has a working distance of several millimeters above the substrate allowing 3D interconnects to be printed with no Z-height adjustments. The Aerosol Jet printhead is configured with multiple nozzles and a closely coupled atomizer to achieve production throughput of greater than 19,000 interconnects per hour. The Aerosol Jet printer deposits silver fine particle ink to form connections on staggered die stacks. High aspect ratio interconnects, less than 30-microns wide and greater than 6-microns tall, are printed at sub 60-micron pitch. After isothermal sintering at 150° C to 200° C for 30 minutes, highly conductive interconnects near bulk resistivity are produced. Pre-production yields exceeding 80% have been realized. This paper will provide further details on the 3D printed interconnect process, current and planned production throughput levels, and process yield and device reliability status.


2011 ◽  
Vol 38 (6Part31) ◽  
pp. 3792-3792
Author(s):  
J Zhou ◽  
E Sebastian ◽  
M Ghilezan ◽  
A Martinez ◽  
D Yan

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