scholarly journals Low-Cost and High-Efficient W-Band Substrate Integrated Waveguide Antenna Array Made of Printed Circuit Board Process

2012 ◽  
Vol 60 (3) ◽  
pp. 1648-1653 ◽  
Author(s):  
Nasser Ghassemi ◽  
Ke Wu ◽  
Stephane Claude ◽  
Xiupu Zhang ◽  
Jens Bornemann
Keyword(s):  
Antenna Array ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit ◽  
W Band ◽  
High Efficient ◽  
Board Process

scholarly journals Using Multilayered Substrate Integrated Waveguide to Design Microwave Gain Equalizer

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Yongfei Wang ◽  
Dongfang Zhou ◽  
Yi Zhang ◽  
Chaowen Chang
Keyword(s):  
Equivalent Circuit ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Equivalent Circuit Analysis ◽  
Compact Structure ◽  
Printed Circuit ◽  
Board Process ◽  
Insight Into ◽  
Ku Band

This paper presents the design and experiment of a novel microwave gain equalizer based on the substrate integrated waveguide (SIW) technique. The proposed equalizer is formed by an SIW loaded by SIW resonators, which has very compact structure and can compensate for gain slope of microwave systems. Equivalent circuit analysis is given about the proposed structure for a better insight into the structure’s response. A Ku-Band equalizer with four SIW resonators is simulated and fabricated with a multilayer printed circuit board process. The measured results show good performance and agreement with the simulated results; an attenuation slope of −4.5 dB over 12.5–13.5 GHz is reached with a size reduction of 76%.

scholarly journals A Low-Cost and Efficient Microstrip-Fed Air-Substrate-Integrated Waveguide Slot Array

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 338
Author(s):  
Linfeng Li ◽  
Jie-Bang Yan
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Low Cost ◽  
Design Procedure ◽  
Substrate Material ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit ◽  
Waveguide Transition ◽  
Pcb Manufacturing

A microstrip-fed air-substrate-integrated waveguide (ASIW) slot array with high efficiency and low cost is presented. The design cuts out the substrate material within SIW, replaces the vias with metallic sidewalls, and uses a simple microstrip line-waveguide transition to feed the slot array. Radiating slots are cut on a 5-mil brass-plate, which covers the top of the substrate cutout to resemble a hollow waveguide structure. This implementation provides a simple and efficient antenna array solution for millimeter-wave (mm-wave) applications. Meanwhile, the fabrication is compatible with the standard printed circuit board (PCB) manufacturing process. To demonstrate the concept, a 4-element ASIW slot array working at the n257 band for 5G communications was designed using low-cost Rogers 4350B and FR4 substrate materials. Our simulation result shows 18% more efficiency than a conventional SIW slot array using the same substrate. The fabricated prototype shows |S11| < −15 dB over 27–29 GHz and a peak realized gain of 10.1 dBi at 28.6 GHz. The design procedure, prototyping process, and design analysis are discussed in the paper.

scholarly journals Wideband and High-Efficiency SIW Cavity-Backed Magneto-Electric Dipole Antenna Array

2019 ◽  
Vol 2019 ◽  
pp. 1-16
Author(s):  
Guang Sun ◽  
Yi Liu ◽  
Taolin Liu ◽  
Hu Yang
Keyword(s):  
Antenna Array ◽  
Printed Circuit Board ◽  
High Efficiency ◽  
High Gain ◽  
Dipole Antenna ◽  
Circuit Board ◽  
Impedance Bandwidth ◽  
Antenna Element ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit

In this paper, a compact, wideband, and high-efficiency substrate integrated waveguide (SIW) feeding cavity-backed aperture-coupled magneto-electric (ME) dipole antenna element and its array are proposed. Firstly, an SIW cavity-backed and a modified bowtie dipole are designed for the antenna element which makes it possess a high gain and wide impedance bandwidth. The antenna element covers an impedance bandwidth of 66.3% from 10.7 to 21.3 GHz with a peak gain of 10.3 dBi. Secondly, a 4 × 4 array is designed using the proposed antenna element. And a full-corporate substrate integrated waveguide feeding network is introduced to excite the array elements for the antenna application with wide bandwidth and high efficiency. For validation, a prototype of 4 × 4 array is fabricated by standard printed circuit board (PCB) facilities and further measured. The measured −10 dB impedance bandwidth of the proposed 4 × 4 antenna array is 30% (12.75–17.25 GHz) with its gain being 18.2–20.9 dBi within the entire band. The measured maximum aperture efficiency of the antenna array is 94% at 14.92 GHz. Notably, the measured results agree well with simulations, and it shows great advantages over other similar antennas on efficiency and bandwidth.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

scholarly journals POSIBILITY OF CREATING A PRINTED SINGLE-LAYER TRANSREFLECTOR WITH INCREASED PHASE EFFICIENCY

2019 ◽  
pp. 139-145
Author(s):  
A. N. Mikhailov
Keyword(s):  
Printed Circuit Board ◽  
Single Layer ◽  
Circuit Board ◽  
Horizontal Polarization ◽  
Radiation Characteristics ◽  
Printed Circuit ◽  
W Band ◽  
New Type ◽  
Reflectarray Antenna ◽  
Geometrical Dimensions

A new type of single‑layer transrefleсtor structure based on microstrip reflective antenna array is described. The developed  device is a single‑layer printed circuit board on one side of which a system of printed reflectors is located, and on the other is  a polarization structure consisting of parallel metal conductors, in contrast to a microstrip reflectarray antenna. The shape and  geometrical dimensions of printed reflectors arranged in a rectangular or hexagonal (triangular) pattern are chosen in such a way  that they transform a spherical front of an incident vertically polarized electromagnetic wave into a flat front of reflected wave. In  the case of irradiation of the developed transreflector with a horizontal polarization wave, the printed structure makes minimal  electromagnetic energy loss during its passage. The results of characteristics modeling (including phase curves) of an element  of the reflective lattice in the W‑band for different angles of incidence of the wave on the planar structure under study are given.  Based on the results obtained, the sizes of the reflective elements of the transreflector, which provide for the correction of the  incident wave with the necessary phase discrete, are determined and an electrodynamic model of the transreflector antenna is  built. The simulation of the main radiation characteristics of the antenna with the developed single‑layer transreflector was carried  out.

A PCB Sensor for Magnetic Materials

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 001323-001342
Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham
Keyword(s):  
Magnetic Materials ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Complex Impedance ◽  
Corrosion Products ◽  
Physical Contact ◽  
Circuit Board ◽  
Sensor Technology ◽  
Printed Circuit ◽  
Surrounding Environment

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.

A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors

2016 ◽  
Vol 2016 (1) ◽  
pp. 000557-000562
Author(s):  
Robert N. Dean ◽  
Frank T. Werner ◽  
Michael J. Bozack
Keyword(s):  
Surface Finish ◽  
Printed Circuit Board ◽  
Chemical Constituents ◽  
Low Cost ◽  
Circuit Board ◽  
Testing Environment ◽  
Printed Circuit ◽  
Sensor Performance ◽  
Sensing Applications ◽  
Surface Finishes

Abstract Printed circuit board (PCB) sensors using low-cost commercial printed circuit board fabrication processes have been demonstrated for environmental sensing applications. One configuration of these sensors uses exposed electrodes to measure saltwater concentration in freshwater/seawater mixtures, through monitoring the resistance between the electrodes when they are immersed in the saltwater/freshwater solution. The lowest cost commercial PCB processes use an immersion Sn HASL surface finish on exposed copper cladding, including the sensing electrodes. This commercial PCB process has been demonstrated to make an effective, low-cost, short-lifetime sensor for saltwater concentration testing. The Sn finish, however, may not be optimal for this application. Sn oxidizes, which can interfere with sensor performance. Additionally, Sn and Sn oxides are potentially reactive with chemical constituents in seawater and seawater/freshwater solutions. An immersion Au (ENIG) surface finish is certainly less reactive with the atmosphere and chemicals likely present in the testing environment. However, an immersion Au finish increases the cost of the sensors by 30% to 40%. To investigate if the possible benefits of the more expensive Au surface finish are worth the extra expense, a study was performed where identical PCB sensors were procured from a commercial vendor with their standard low-cost Sn HASL finish and with their standard ENIG surface finish. Both sets of sensors were then evaluated in concentrations of seawater and freshwater, from 0% to 100% seawater concentration, using freshwater samples from a natural freshwater source near the coast where the seawater was obtained. Testing demonstrated an insignificant difference in sensor performance between the Sn HASL and the ENIG coated sensing electrodes. The results of this investigation indicated that for applications where the sensors will not be used for long periods of time, the added expense of an immersion Au surface finish is not worth the added cost.

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