Unit-Cell Modeling of High-Speed Interconnect with Adjacent Metal-Filled Via Array using FDTD method
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2015 ◽
Vol 74
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pp. 97-110
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2016 ◽
Vol 88
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pp. 347-348
2020 ◽
Vol 184
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pp. 105831
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2014 ◽
Vol 1044-1045
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pp. 1362-1365
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