Cascading link failure analysis in interdependent networks for maximal outages in smart grid

2016 ◽  
Author(s):  
Parisa Akaber ◽  
Bassam Moussa ◽  
Mourad Debbabi ◽  
Chadi Assi
Keyword(s):  
Smart Grid ◽  
Failure Analysis ◽  
Link Failure ◽  
Interdependent Networks

Failure Analysis of Fiber Optic Communication System in Deep-Water Remotely Operated Vehicle ROSUB 6000

2014 ◽  
Vol 48 (3) ◽  
pp. 63-72 ◽  
Author(s):  
Raju Ramesh ◽  
Dharmaraj Sathianarayanan ◽  
Vittal Doss Prakash ◽  
Arumugam Vadivelan ◽  
Sethuraman Ramesh ◽  
...  
Keyword(s):  
Low Temperature ◽  
Failure Analysis ◽  
Deep Water ◽  
Fiber Optic ◽  
Single Mode ◽  
Single Mode Fiber ◽  
Link Failure ◽  
Remotely Operated Vehicle ◽  
Link Loss ◽  
Optic Communication

AbstractSingle-mode fiber optic systems can play vital roles in cabled deep-water vehicle operations at greater depths (>3,000 m). One kind of single-mode fiber optic system, the ROSUB 6000, is used in a deep-water work-class remotely operated vehicle (ROV). Fiber optic link failure of ROV telemetry and sound navigation and ranging were noticed at a water depth of 3,050 m during the ROSUB 6000 system sea trials. A failure analysis of the fiber optic communication system was carried out with the link data logged during different phases of the deep-sea trials. The results from the failure analysis carried out during deep-sea trials showed an increase in the fiber optic link loss from a depth of 900 m onwards. Further analysis of the fiber optic link loss in the laboratory involved pressure and low-temperature testing of all the subsea components in the ROV telemetry link. From the laboratory pressure test results, it was concluded that pressure was not the root cause of the fiber optic link failure. On further analysis, a complete fiber optic link failure was noticed during the low-temperature testing of the subsea components. Furthermore, the low-temperature testing of the individual subsea components revealed that the fiber optic rotary joint (FORJ) insertion loss increased rapidly at low temperatures. This FORJ insertion loss led to complete failure of the fiber optic links in the ROV. The degradation of index-matching fluid in the FORJ was identified to be the root cause of fiber link failure.

scholarly journals Software Defined Networks Security: Link Failure Analysis in SDN

2019 ◽  
Vol 557 ◽  
pp. 012039
Author(s):  
M A H. Al-Junaid ◽  
Mohd Nazri Bin Mohd Warip ◽  
R Badlishah Ahmad ◽  
Anuar Mat Safar ◽  
I Zunaidi ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Link Failure ◽  
Software Defined Networks

Measuring Cascading Failures in Smart Grid Networks

2016 ◽  
pp. 208-225
Author(s):  
Sotharith Tauch ◽  
William Liu ◽  
Russel Pears
Keyword(s):  
Smart Grid ◽  
Power Systems ◽  
Critical Infrastructure ◽  
Average Distance ◽  
Electrical Power ◽  
Cascading Failures ◽  
Electrical Power Systems ◽  
Interdependent Networks ◽  
Grid Networks ◽  
Degree Correlation

Smart Grid is the next generation of the electrical power systems that form from interdependent networks. Cascading failures in such interdependent critical infrastructure is very crucial which can cause wide spread disruption. This chapter is intended to evaluate four different topological metrics in which can be best described and approximated the behavior of cascading failures in interdependent networks by employing two interlinks strategies such as random interlinks addition and degree-degree correlation interlinks. The four chosen topological metrics are algebraic connectivity, effective graph resistance, average betweenness centrality, and average distance. Throughout the chapter, analytical study of each metric are discussed and also compared with numerical simulation based on sandpile dynamics load distribution.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

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