Development of a wireless environmental sensor system and MEMS-based RF circuit components

2005 ◽  
Author(s):  
Euisik Yoon ◽  
Kwang-Seok Yun
Keyword(s):  
Sensor System ◽  
Environmental Sensor ◽  
Circuit Components ◽  
Rf Circuit

scholarly journals Environmental sensor system for expanded capability of PEM fuel cell use in high air contaminant conditions

2018 ◽  
Vol 43 (50) ◽  
pp. 22584-22594 ◽  
Author(s):  
Scott R. Higgins ◽  
James Ewan ◽  
Jean St-Pierre ◽  
Godwin Severa ◽  
Kevin Davies ◽  
...  
Keyword(s):  
Fuel Cell ◽  
Pem Fuel Cell ◽  
Sensor System ◽  
Environmental Sensor ◽  
Air Contaminant

A LoRaWAN-Based Environmental Sensor System for Urban Tree Health Monitoring

2021 ◽  
Author(s):  
Haokai Zhao ◽  
Kevin A. Kam ◽  
Ioannis Kymissis ◽  
Patricia J. Culligan
Keyword(s):  
Health Monitoring ◽  
Sensor System ◽  
Tree Health ◽  
Urban Tree ◽  
Environmental Sensor

Self-powered environmental sensor system driven by nanogenerators

2011 ◽  
Vol 4 (9) ◽  
pp. 3359 ◽  
Author(s):  
Minbaek Lee ◽  
Joonho Bae ◽  
Joohyung Lee ◽  
Churl-Seung Lee ◽  
Seunghun Hong ◽  
...  
Keyword(s):  
Sensor System ◽  
Environmental Sensor ◽  
Self Powered

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Light Sensor System Measuring Declination and Orientation

2010 ◽  
Vol 130 (10) ◽  
pp. 495-500
Author(s):  
Toyokazu Tambo ◽  
Yuuji Miyamoto ◽  
Shuuhei Sakashita ◽  
Miki Shibata
Keyword(s):  
Sensor System ◽  
Light Sensor
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