Improvement of multi-crystalline silicon wafer quality during solar cell fabrication process

2009 ◽  
Author(s):  
Jasmin Hofstetter ◽  
Jean-Franccois Lelievre ◽  
Carlos del Canizo ◽  
Antonio Luque
Keyword(s):  
Solar Cell ◽  
Silicon Wafer ◽  
Crystalline Silicon ◽  
Fabrication Process ◽  
Solar Cell Fabrication ◽  
Cell Fabrication

scholarly journals Evaluation of plasma induced defects on silicon substrate by solar cell fabrication process

2020 ◽  
Vol 59 (7) ◽  
pp. 071003
Author(s):  
Kohei Onishi ◽  
Yutaka Hara ◽  
Tappei Nishihara ◽  
Hiroki Kanai ◽  
Takefumi Kamioka ◽  
...  
Keyword(s):  
Solar Cell ◽  
Silicon Substrate ◽  
Fabrication Process ◽  
Solar Cell Fabrication ◽  
Cell Fabrication ◽  
Induced Defects

scholarly journals Isolation of III-V/Ge Multijunction Solar Cells by Wet Etching

2013 ◽  
Vol 2013 ◽  
pp. 1-7
Author(s):  
A. Turala ◽  
A. Jaouad ◽  
D. P. Masson ◽  
S. Fafard ◽  
R. Arès ◽  
...  
Keyword(s):  
Solar Cells ◽  
Solar Cell ◽  
Cell Size ◽  
Charge Trapping ◽  
Wet Etching ◽  
Fabrication Process ◽  
Multijunction Solar Cells ◽  
Solar Cell Fabrication ◽  
Cell Fabrication ◽  
Trapping Centers

Microfabrication cycles of III-V multijunction solar cells include several technological steps and end with a wafer dicing step to separate individual cells. This step introduces damage at lateral facets of the junctions that act as charge trapping centers, potentially causing performance and reliability issues, which become even more important with today’s trend of cell size reduction. In this paper we propose a process of wet etching of microtrenches that allows electrical isolation of individual solar cells with no damage to the sidewalls. Etching with bromine-methanol, the solution that is typically used for nonselective etching of III-V compounds, results in the formation of unwanted holes on the semiconductor surfaces. We investigate the origin of holes formation and discuss methods to overcome this effect. We present an implementation of the isolation step into a solar cell fabrication process flow. This improved fabrication process opens the way for improved die strength, yield, and reliability.

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