Fine-Grain, End-to-End Security for Web Service Compositions

Author(s):  
Lenin Singaravelu ◽  
Calton Pu
Keyword(s):  
2006 ◽  
Vol 9 (1) ◽  
pp. 85-101 ◽  
Author(s):  
Patrick C. K. Hung ◽  
Dickson K. W. Chiu ◽  
W. W. Fung ◽  
William K. Cheung ◽  
Raymond Wong ◽  
...  

Author(s):  
J. R. Arias ◽  
F. J. Suárez ◽  
D. F. García ◽  
J. I. Marín
Keyword(s):  

2021 ◽  
Vol 18 (2) ◽  
pp. 1-22
Author(s):  
Maxime France-Pillois ◽  
Jérôme Martin ◽  
Frédéric Rousseau

Multi-core systems are now found in many electronic devices. But does current software design fully leverage their capabilities? The complexity of the hardware and software stacks in these platforms requires software optimization with end-to-end knowledge of the system. To optimize software performance, we must have accurate information about system behavior and time losses. Standard monitoring engines impose tradeoffs on profiling tools, making it impossible to reconcile all the expected requirements: accurate hardware views, fine-grain measurements, speed, and so on. Subsequently, new approaches have to be examined. In this article, we propose a non-intrusive, accurate tool chain, which can reveal and quantify slowdowns in low-level software mechanisms. Based on emulation, this tool chain extracts behavioral information (time, contention) through hardware side channels, without distorting the software execution flow. This tool consists of two parts. (1) An online acquisition part that dumps hardware platform signals. (2) An offline processing part that consolidates meaningful behavioral information from the dumped data. Using our tool chain, we studied and propose optimizations to MultiProcessor System on Chip (MPSoC) support in the Linux kernel, saving about 60% of the time required for the release phase of the GNU OpenMP synchronization barrier when running on a 64-core MPSoC.


Author(s):  
R. Sinclair ◽  
B.E. Jacobson

INTRODUCTIONThe prospect of performing chemical analysis of thin specimens at any desired level of resolution is particularly appealing to the materials scientist. Commercial TEM-based systems are now available which virtually provide this capability. The purpose of this contribution is to illustrate its application to problems which would have been intractable until recently, pointing out some current limitations.X-RAY ANALYSISIn an attempt to fabricate superconducting materials with high critical currents and temperature, thin Nb3Sn films have been prepared by electron beam vapor deposition [1]. Fine-grain size material is desirable which may be achieved by codeposition with small amounts of Al2O3 . Figure 1 shows the STEM microstructure, with large (∽ 200 Å dia) voids present at the grain boundaries. Higher quality TEM micrographs (e.g. fig. 2) reveal the presence of small voids within the grains which are absent in pure Nb3Sn prepared under identical conditions. The X-ray spectrum from large (∽ lμ dia) or small (∽100 Ǻ dia) areas within the grains indicates only small amounts of A1 (fig.3).


Sign in / Sign up

Export Citation Format

Share Document