Void and extrusion induced failure of submicron multilevel interconnects

2004 IEEE International Reliability Physics Symposium. Proceedings ◽

10.1109/relphy.2004.1315423 ◽

2004 ◽

Author(s):

Yong-Bum Jo ◽

Jongwoo Park ◽

Chul-Hee Jeon ◽

Kyung-Il Ouh ◽

Hyun-Goo Jeon

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