Emerging role of semiconductor process equipment to overcome device failure mechanisms

2002 ◽  
Author(s):  
A.K. Sinha ◽  
F. Moghadam ◽  
R. Mosley ◽  
M. Chang ◽  
R. Ellwanger
Keyword(s):  
Failure Mechanisms ◽  
Process Equipment ◽  
Device Failure ◽  
Semiconductor Process

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Investigation of device failure mechanisms in polymer light-emitting diodes

1997 ◽  
Vol 85 (1-3) ◽  
pp. 1213-1214 ◽  
Author(s):  
Ramesh K. Kasim ◽  
Yang Cheng ◽  
Martin Pomerantz ◽  
Ronald L. Elsenbaumer
Keyword(s):  
Light Emitting Diodes ◽  
Failure Mechanisms ◽  
Light Emitting ◽  
Device Failure ◽  
Polymer Light Emitting Diodes

The Role of Interface on the Toughening and Failure Mechanisms of Thermoplastic Nanocomposites Reinforced with Nanofibrillated Rubber

Nanoscale ◽  
2021 ◽  
Author(s):  
Mahdi Zeidi ◽  
Chun Il Kim ◽  
Chul B B. Park
Keyword(s):  
Polymer Nanocomposites ◽  
Functional Properties ◽  
Crucial Role ◽  
Failure Mechanisms

Interface plays a crucial role on the physical and functional properties of polymer nanocomposites, yet its effects have not been fully recognized in the setting of classical continuum-based modeling. In...

Role of Failure-Mechanism Identification in Accelerated Testing

1993 ◽  
Vol 36 (4) ◽  
pp. 39-45
Author(s):  
J. Hu ◽  
D. Barker ◽  
A. Dasgupta ◽  
A. Arora
Keyword(s):  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Electronic Devices ◽  
Operating Conditions ◽  
Accelerated Life Testing ◽  
Accelerated Testing ◽  
Normal Operating ◽  
Accelerated Life ◽  
Cut Method

Accelerated life testing techniques provide a short-cut method to investigate the reliability of electronic devices with respect to certain dominant failure mechanisms that occur under normal operating conditions. However, accelerated tests have often been conducted without knowledge of the failure mechanisms and without ensuring that the test accelerated the same mechanism as that obscrved under normal operating conditions. This paper summarizes common failure mechanisms in electronic devices and packages and investigates possible failure mechanism shifting during accelerated testing.

Mechanical Behavior and Failure Mechanisms of SCS-6/Ti3Al Composites

1990 ◽  
Vol 194 ◽  
Author(s):  
S. M. Jeng ◽  
C. J. Yang ◽  
J.-M. Yang ◽  
D. G. Rosenthal ◽  
J. Goebel
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Room Temperature ◽  
Failure Mechanisms ◽  
Crack Initiation And Propagation ◽  
Al Composite ◽  
Initiation And Propagation ◽  
Bend Tests ◽  
Scanning Electron

AbstractThe mechanical properties and failure mechanisms of the SCS-6/Ti3Al composite have been studied. Both tensile and notched bend tests were conducted at room temperature on the monolithic and fiber-reinforced Ti-25Al-10Nb-3V-1Mo. Optical and scanning electron microscopy were used to study the crack initiation and propagation mechanisms. The role of the fiber, matrix and interfacial properties on the composite behavior was also assessed.

scholarly journals Numerical and Experimental Analysis of Full Scale Arches Reinforced with GFRP Materials

2014 ◽  
Vol 624 ◽  
pp. 502-509 ◽  
Author(s):  
Ismael Basilio ◽  
Roberto Fedele ◽  
Paulo B. Lourenço ◽  
Gabriele Milani
Keyword(s):  
Upper Bound ◽  
Limit Analysis ◽  
Experimental Analysis ◽  
Failure Mechanisms ◽  
Peak Load ◽  
Numerical Results ◽  
Masonry Arches ◽  
Reinforced Masonry ◽  
The University

In this contribution, original limit analysis numerical results are presented dealing with some reinforced masonry arches tested at the University of Minho-UMinho, PT. Twelve in-scale circular masonry arches were considered, reinforced in various ways at the intrados or at the extrados. GFRP reinforcements were applied either on undamaged or on previously damaged elements, in order to assess the role of external reinforcements even in repairing interventions. The experimental results were critically discussed at the light of limit analysis predictions, based on a 3D FE heterogeneous upper bound approach. Satisfactory agreement was found between experimental evidences and the numerical results, in terms of failure mechanisms and peak load.

Investigation of Failure Mechanisms in Ti Containing Brazing Alloys Used in SOFC/SOEC Environments

2010 ◽  
Author(s):  
Wolff-Ragnar Kiebach ◽  
Ruth Knibbe ◽  
Kristian B. Frederiksen ◽  
Ming Chen ◽  
Lars Mikkelsen ◽  
...  
Keyword(s):  
Ferritic Steel ◽  
Failure Mechanisms ◽  
Annealing Process ◽  
Yttria Stabilized Zirconia ◽  
Reaction Products ◽  
Stabilized Zirconia ◽  
Advantages And Disadvantages ◽  
Active Metal ◽  
Reported Data

The two braze alloys TiCuNi® and Silver-ABA® were tested as possible candidates for seals in SOFC or SOEC stacks. The different Ti amount in the samples allowed an evaluation of Ti as a matrix filler and as an active metal/wetting agent in brazing alloys. The sealing ability towards ferritic steel and yttria-stabilized-zirconia (YSZ) was investigated. After the sealing process steel/braze/YSZ joints were further annealed in oxidizing (Air) or reducing (9% H2 in Ar) atmospheres at 750 °C for 150 h. The boundaries of the braze and the joining partners for as-sealed and annealed samples were examined with SEM/EDS. XRD and EXAFS were used to characterize reaction products after the annealing process. Based on these results and taking before reported data into consideration, the advantages and disadvantages of Ti containing seals and the role of Ti in failure mechanism are discussed. Even if the use of Ti in active brazing alloys has its benefits, the disadvantages caused by Ti and its reaction products strongly suggest the use of Ti free brazes in SOFC/SOEC applications.

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