Testing and Debugging in Continuous Integration with Budget Quotas on Test Executions

2016 ◽  
Author(s):  
Bo Jiang ◽  
W.K. Chan
Keyword(s):  
Testing And Debugging ◽  
Continuous Integration

Approximation and Continuous Integration of Experimental Amber Processing Data

2020 ◽  
Vol 150 (2/2020) ◽  
pp. 121-124
Author(s):  
M.A. Perepelkin ◽  
V.V. Kurbatova ◽  
V.I. Sklyanov ◽  
V.V. Tyutyunin ◽  
M.V. Kozlov
Keyword(s):  
Continuous Integration ◽  
Processing Data

Comparative Assessment of Optical Techniques for Semi-Invasive SRAM Data Read-out on an MSP430 Microcontroller

2018 ◽  
Author(s):  
Tuba Kiyan ◽  
Heiko Lohrke ◽  
Christian Boit
Keyword(s):  
Supply Voltage ◽  
Photon Emission ◽  
Random Access ◽  
Integration Time ◽  
Security Evaluation ◽  
Testing And Debugging ◽  
Advantages And Disadvantages ◽  
The Core ◽  
Voltage Signal ◽  
Chip Testing

Abstract This paper compares the three major semi-invasive optical approaches, Photon Emission (PE), Thermal Laser Stimulation (TLS) and Electro-Optical Frequency Mapping (EOFM) for contactless static random access memory (SRAM) content read-out on a commercial microcontroller. Advantages and disadvantages of these techniques are evaluated by applying those techniques on a 1 KB SRAM in an MSP430 microcontroller. It is demonstrated that successful read out depends strongly on the core voltage parameters for each technique. For PE, better SNR and shorter integration time are to be achieved by using the highest nominal core voltage. In TLS measurements, the core voltage needs to be externally applied via a current amplifier with a bias voltage slightly above nominal. EOFM can use nominal core voltages again; however, a modulation needs to be applied. The amplitude of the modulated supply voltage signal has a strong effect on the quality of the signal. Semi-invasive read out of the memory content is necessary in order to remotely understand the organization of memory, which finds applications in hardware and software security evaluation, reverse engineering, defect localization, failure analysis, chip testing and debugging.

Development perspective microelectromechanical systems (MEMS)by methods of semi-real simulation

2006 ◽  
Vol 4 ◽  
pp. 288-305
Author(s):  
A.B. Migranov
Keyword(s):  
Virtual Environment ◽  
Microelectromechanical Systems ◽  
Testing And Debugging ◽  
Development Perspective

The article deals with the issues related to the construction of microelectromechanical systems (MEMS), and the problems arising from their manufacture. Particular attention is paid to micromechanical parts of robot, which were developed by methods of semi-simulation using the virtual environment for designing, testing and debugging MEMS.

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