A high repetition rate laser system

1964 ◽  
Vol 52 (1) ◽  
pp. 93-93 ◽  
Author(s):  
W.T. Haswell ◽  
J.S. Hitt ◽  
J.M. Feldman
Keyword(s):  
Repetition Rate ◽  
Laser System ◽  
High Repetition Rate ◽  
High Repetition

Optimisation of a multi-disk cryogenic amplifier for a high-intensity, high-repetition-rate laser system

2018 ◽  
Vol 48 (4) ◽  
pp. 358-362 ◽  
Author(s):  
V V Petrov ◽  
G V Kuptsov ◽  
V A Petrov ◽  
A V Laptev ◽  
A V Kirpichnikov ◽  
...  
Keyword(s):  
Repetition Rate ◽  
High Intensity ◽  
Laser System ◽  
High Repetition Rate ◽  
High Repetition

Electron-beam-pumped high-repetition-rate KrF laser system

2000 ◽  
Author(s):  
Eiichi Takahashi ◽  
Isao Okuda ◽  
Yuji Matsumoto ◽  
Isao Matsushima ◽  
Susumu Kato ◽  
...  
Keyword(s):  
Electron Beam ◽  
Repetition Rate ◽  
Laser System ◽  
High Repetition Rate ◽  
High Repetition ◽  
Krf Laser

scholarly journals Femtosecond Laser Machining At Submicron And Nano Scale

2021 ◽  
Author(s):  
Alireza Dalili
Keyword(s):  
Femtosecond Laser ◽  
Pulse Energy ◽  
Repetition Rate ◽  
Pulse Width ◽  
Laser System ◽  
High Repetition Rate ◽  
Silicon Wafers ◽  
Good Precision ◽  
High Repetition ◽  
Nano Scale

The arrival of the femtosecond laser with a MHz repetition rate has provided the industry with a new tool to conduct submicron and nano scale machining. Several advantages such as high quality machining finish, good precision and high throughput can be obtained when using femtosecond laser to conduct nanomachining over lithography techniques currently in use. High repetition rate systems are preferred over low repetition rate femtosecond laser systems that have been studied by others due to their increased stability, speed, quality and discovery of new phenomena such as ripples and grains. This thesis proposes a high repetition rate fiber femtosecond laser system for meeting the above-mentioned conditions. The influence of the laser repetition rate and pulse energy on the size and quality of nano features fabricated on silicon wafers was investigated. Higher repetition rates led to smaller cutlines with uniform width. A 110 nm crater with a small heat affected zone of 0.79 µm was obtained at 13 MHz repetition rate and 2.042 J/cm² energy fluence. In terms of nanomachining below the ablation threshold (surface patterning), the influence of pulse width, repetition rate and pulse energy on the spacing of ripples, as well as diameter of grains created on silicon wafers, was examined. For the pulse width, repetition rate and pulse energy range used, the ripple spacing and grain diameter increased with laser pulse duration while other parameters did not play a significant role. These results show the capability of the proposed system in meeting the industry requirements.

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