ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology

2007 ◽  
Author(s):  
Tatsuo Nagamatsu ◽  
Yuuji Kakiuchi ◽  
Yasuhiro Suga
Keyword(s):  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film ◽  
Bonding Technology

Effects of Ultrasonic Power on Bonding Strength of Anisotropic Conductive Film Joint in Chip-on-Glass Assembly

2011 ◽  
Vol 189-193 ◽  
pp. 3466-3469
Author(s):  
Yong Cheng Lin ◽  
Hao Jin ◽  
Xiao Nan Fang ◽  
Jun Zhang
Keyword(s):  
Electronic Packaging ◽  
Bonding Strength ◽  
Flip Chip ◽  
Ultrasonic Power ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film ◽  
Bonding Technology

Polymer-based anisotropic conductive film has become widely used in many electronic packaging interconnect applications. In this study, thermosonic flip chip bonding technology for anisotropic conductive film (ACF) joints of chip-on-glass (COG) assembly is investigated. The effects of ultrasonic power on the curing degree and bonding strength of anisotropic conductive film joints are discussed. The results show that (1) The bonding strength of the ACF joints firstly increases and then fast decreases when the ultrasonic power is continuously increased; (2) The curing degree of ACF material increases with the increase of the ultrasonic power. When the ultrasonic power is 3.52W, the curing degree of ACF material can reach 94.1%; (3) The optimized value of ultrasonic power is 3.5W for the studied assembly.

Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB

2020 ◽  
Author(s):  
Serguei Stoukatch ◽  
Nicolas Andre ◽  
Thibault Delhaye ◽  
Francois Dupont ◽  
Jean-Michel Redoute ◽  
...  
Keyword(s):  
Flip Chip ◽  
Low Cost ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film

Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000474-000518
Author(s):  
Hiroshi Komatsu
Keyword(s):  
Screen Printing ◽  
Flip Chip ◽  
Bonding Temperature ◽  
Complex Form ◽  
Fine Tuning ◽  
Electric Resistance ◽  
Flip Chip Bonding ◽  
Strong Adhesion ◽  
Bonding Technology ◽  
Ag Paste

Since its early days of the industry, electronics apparatus has been in a rigid and flat surfaced case. ICs have been soldered on rigid substrate at high bonding temperature. However, in the IoT era, electronics components connect with the variety of applications which require different forms and shapes of outlook which lead substrate and board should be flexible and complex form. Conventional flip chip bonding technology, such as solder bump and copper pillar, need to raise bonding temperature around 260-degree C, eventually does not satisfy this flexile hybrid electronics (FHE) application requirement. We have originally developed flip chip bonding technology which consists of the bump formation by Conductive Paste (CP) printing followed by Non-Conductive Paste (NCP) dispensing and flip chip bonding at temperature as low as 120-degree C. Bumps with silver particle loaded epoxy resin on substrate were formed by screen printing. This enable us to make fine bump formation down to 60um minimum bump pitch and 30um bump diameter with tuning of screen-printing process. After the bump formation, NCP dispensing and flip chip bonding at 120-degree C which secure reasonable low electric resistance, 8×1E-4 ohm cm2, and strong adhesion of chip and substrate. The bonding temperature of this technology can be lowered down to 80-degree C without much difficulties, but just by fine tuning of Ag paste and its contents. This momentum will create a lot more of future applications and be one of the core technologies in the coming IoT era in FHE.

Reliability Assessment of Flip-chip Assembly of Al Bumps

2014 ◽  
Vol 2014 (1) ◽  
pp. 000301-000306
Author(s):  
Hidekazu TANISAWA ◽  
Kohei HIYAMA ◽  
Takeshi ANZAI ◽  
Hiroki TAKAHASHI ◽  
Yoshinori MURAKAMI ◽  
...  
Keyword(s):  
High Temperatures ◽  
Flip Chip ◽  
Recrystallization Temperature ◽  
Exposure Test ◽  
Bonding Wire ◽  
Flip Chip Bonding ◽  
Bonding Technology ◽  
A New Technique ◽  
Temperature Exposure ◽  
Surface Mounting

This paper reports on a flip-chip bonding technology using an aluminum bump at high temperatures, such as for SiC semiconductors. In recent years, double-sided mounting structures have been proposed for the purposes of miniaturization and low inductance. The surface mounting method requires durability to withstand high temperatures. We propose a new technique for the flip-chip bonding of an Al bump made from bonding wire. The recrystallization temperature of aluminum is under 250 °C. As a result, there is an expectation of mitigating mechanical stress between the chip and bonded substrate. A high-temperature exposure test at 250 °C for 3000 hours and a thermal-cycle test between −40 and 250 °C for 3000 cycles have been executed. Results indicate that shear strength of the Al bump meets the requirements set forth in the IEC60749-19 guideline until 2000 cycles at room temperature.

New Flip-Chip Bonding Technology for Superconducting IC

1992 ◽  
Vol 31 (Part 2, No.1A/B) ◽  
pp. L36-L38 ◽  
Author(s):  
Toshinori Ogashiwa ◽  
Hiroshi Nakagawa ◽  
Hideyuki Akimoto ◽  
Hiroyuki Shigyo ◽  
Susumu Takada
Keyword(s):  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technology
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