High frequency flip chip interconnection on liquid crystal polymer substrate using anisotropic conductive adhesive
2016 ◽
Vol 56
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pp. 114-120
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Keyword(s):
2014 ◽
Vol 13
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pp. 1172-1175
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Keyword(s):
2002 ◽
Vol 25
(4)
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pp. 503-508
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Keyword(s):
2008 ◽
Vol 30
(2)
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pp. 183-189
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Keyword(s):
2008 ◽
Vol 18
(9)
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pp. 581-583
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Keyword(s):
2003 ◽
Vol 51
(12)
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pp. 2562-2567
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Keyword(s):