Anisotropic effect when using isotropic conductive adhesives

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402736 ◽

2005 ◽

Author(s):

J. Felba ◽

A. Moscicki ◽

M. Bereski

Keyword(s):

Conductive Adhesives ◽

Anisotropic Effect ◽

Isotropic Conductive Adhesives

Download Full-text

Numerical analysis of polymer cure kinetics in isotropic conductive adhesives

33rd International Spring Seminar on Electronics Technology, ISSE 2010 ◽

10.1109/isse.2010.5547360 ◽

2010 ◽

Author(s):

T. Tilford ◽

J. E. Morris ◽

M. Ferenets ◽

P. R. Rajaguru ◽

S. Pavuluri ◽

...

Keyword(s):

Numerical Analysis ◽

Cure Kinetics ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives

Download Full-text

Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757278 ◽

2003 ◽

Cited By ~ 3

Author(s):

Daoqiang Lu ◽

Q.K. Tong ◽

C.P. Wong

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives

Download Full-text

Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507801 ◽

2008 ◽

Cited By ~ 4

Author(s):

R. Durairaj ◽

S. Mallik ◽

A. Seman ◽

A. Marks ◽

N.N. Ekere

Keyword(s):

Viscoelastic Properties ◽

Flip Chip ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives ◽

Solder Pastes ◽

Flip Chip Assembly

Download Full-text

Synthesis of carboxylated-silver nanowires: Electrical conductivity enhancement of isotropic conductive adhesives and long-term stability in a mixture of solvents

Advanced Powder Technology ◽

10.1016/j.apt.2021.10.035 ◽

2021 ◽

Author(s):

S.M. Hosseini-Shahisavandi ◽

M.M. Zerafat

Keyword(s):

Electrical Conductivity ◽

Silver Nanowires ◽

Conductive Adhesives ◽

Conductivity Enhancement ◽

Term Stability ◽

Long Term Stability ◽

Isotropic Conductive Adhesives

Download Full-text

Electrically isotropic conductive adhesives: an effective contact resistance model for conductivity development

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757327 ◽

2003 ◽

Cited By ~ 2

Author(s):

Mikrajuddin Abdullah ◽

F.G. Shi ◽

S. Chungpaiboonpatana ◽

K. Okuyama ◽

C. Davidson ◽

...

Keyword(s):

Contact Resistance ◽

Conductive Adhesives ◽

Effective Contact ◽

Isotropic Conductive Adhesives ◽

Resistance Model

Download Full-text

Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives

Journal of Thermal Analysis and Calorimetry ◽

10.1007/s10973-011-1340-0 ◽

2011 ◽

Vol 105 (1) ◽

pp. 151-155 ◽

Cited By ~ 11

Author(s):

R. Durairaj ◽

Lam Wai Man

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives

Download Full-text

Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)

Materials Science Forum ◽

10.4028/www.scientific.net/msf.580-582.213 ◽

2008 ◽

Vol 580-582 ◽

pp. 213-216

Author(s):

Seong Hyuk Lee ◽

Jung Hee Lee ◽

Jin Woon Lee ◽

Jong Min Kim

Keyword(s):

Numerical Analysis ◽

Numerical Method ◽

Volume Fraction ◽

Conductive Adhesive ◽

Conductive Adhesives ◽

Joining Technology ◽

Isotropic Conductive Adhesives

A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.

Download Full-text

Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives

Journal of Materials Engineering and Performance ◽

10.1007/s11665-011-9918-z ◽

2011 ◽

Vol 21 (3) ◽

pp. 353-357 ◽

Cited By ~ 5

Author(s):

Kai Dai ◽

Guangping Zhu ◽

Luhua Lu ◽

Graham Dawson

Keyword(s):

Large Scale ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives ◽

Highly Effective ◽

Large Scale Synthesis ◽

Silver Nanodendrites

Download Full-text

Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) ◽

10.1109/eptc.2013.6745763 ◽

2013 ◽

Author(s):

R. Durairaj ◽

Chew Chee Sean ◽

Tan Chia Chiun ◽

Liew Jian Ping

Keyword(s):

Thermal Behavior ◽

Conductive Adhesives ◽

Isotropic Conductive Adhesives

Download Full-text

Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder

Soldering & Surface Mount Technology ◽

10.1108/09540910610665125 ◽

2006 ◽

Vol 18 (2) ◽

pp. 40-45 ◽

Cited By ~ 35

Author(s):

Masahiro Inoue ◽

Katsuaki Suganuma

Keyword(s):

Electrical Properties ◽

Conductive Adhesives ◽

Curing Conditions ◽

Isotropic Conductive Adhesives

Download Full-text