New snap cure materials

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973288 ◽

2002 ◽

Author(s):

M. Bauer ◽

J. Bauer

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