In-Network Computing Powered Mobile Edge: Toward High Performance Industrial IoT

IEEE Network ◽  
2020 ◽  
pp. 1-7
Author(s):  
Tianle Mai ◽  
Haipeng Yao ◽  
Song Guo ◽  
Yunjie Liu
Keyword(s):  
High Performance ◽  
Network Computing ◽  
Industrial Iot

Cloud Computing Environment for Engineering and Business Education

2013 ◽  
Vol 837 ◽  
pp. 651-656
Author(s):  
Gabriel Raicu ◽  
Alexandra Raicu
Keyword(s):  
Cloud Computing ◽  
High Performance ◽  
Virtual Machines ◽  
Predictive Analytics ◽  
Network Computing ◽  
Computing Environment ◽  
Business Training ◽  
Cloud Computing Environment ◽  
Processing Power ◽  
Business Simulations

The authors present the development of a scientific cloud computing environment (SCCE) for engineering and business simulations that offers high performance computation capability. The software platform consists of a scalable pool of virtual machines running a UNIX-like (Linux) or UNIX-derivative (FreeBSD) operating systems using specialised software based on modelling engineering processes and focused on business training and predictive analytics using simulations. The use of advanced engineering simulation technology allows engineers to understand and predict the future performance of complex structures and systems designs which can be optimized to reduce risk, improve performance or enhance survivability. A key component of cloud computing in Universities as well as in other research centers: they can share computing resources beyond their technical capabilities. With cloud computing, this allows them all to have access to large scales processing power based on KVM (Kernel based Virtual Machine). Our solution provides a more productive approach: a full scale virtualised computer with scalable storage space and instantly upgradable processing capability. It has more flexibility than other network computing systems and saves precious research time and money. Unlike the existing systems, the scientific community can receive support from a large number of specialists who may contribute by in a collaborative way.

DIMM-in-a-PACKAGE (DIAP) signal integrity for high-performance on-board memory applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000223-000227 ◽  
Author(s):  
Zhuowen Sun ◽  
Kevin Chen ◽  
Richard Crisp
Keyword(s):  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Signal Integrity ◽  
Bottom Layer ◽  
Data Rate ◽  
Optimization Techniques ◽  
Network Computing ◽  
Memory Applications ◽  
Type 3

The recent explosion of thin notebooks and tablets has challenged the IC packaging industry to come up with new solutions of DRAM integration onto motherboard. Beyond traditional SO-DIMMs, innovative memory solutions should perform well at high speed (1600 MT/s) with much reduced footprint and z-height, while leveraging current manufacturing infrastructure for lower cost and also enabling simpler and cheaper motherboard design. To accomplish all the goals stated above for high-performance on-board memory applications, we showed a new DIMM-in-a-Package (DIAP) technology. This 22.5×17.5×1.2mm quad-die face-down (QFD) part has four standard center bond DDR3L dies (each ×16) face-down, which are wire-bonded to the bottom layer of the 407-ball BGA package. This judiciously designed package places data nets at the peripheral and command/control/address nets in the middle of the BGA. As such, motherboard design and layout were substantially simplified to allow the use of low-cost non-HDI Type 3 board for signal integrity performance comparable to expensive HDI boards. The QFD™ ball assignment could accommodate future memory density expansion and different memory type (e.g. LPDDR3, DDR4). It also enables dual-rank operations in each channel when double-sided assembly is used. We successfully demonstrated in production build that 1GB ×64 DDR3L QFD with data rate of 1600 MT/s can be achieved on a Type 3 motherboard for the Intel Haswell mobile platform in dual-channel dual-rank operation. A balanced-T Command/Address topology between the processor and the memory was implemented in a DELL XPS 12 Ultrabook. Channel simulations including chip, package and board were performed. We also conducted cross-talk analysis up to 9 aggressors to take into account the timing impact from the dense routing inside QFD. Layout optimization techniques for best signal integrity, such as trace length matching and stub length minimization, were discussed in detail and applied to both package and motherboard design. Lastly, we also presented and discussed DIAPs currently under study with different memory bus topologies for even higher data rate up to 2400 MT/s using the same QFD technology. Our results and analysis demonstrated DIAP using wirebond-based QFD technology as a viable candidate for the compact, low-cost, high-performance on-board memory solution. We have identified several key aspects of DIAP architecture design and physical layout that are strongly impacting the SI of QFD parts at rate >1600 MT/s and that could be optimized for DDR4 operations. QFD DIAP can become an attractive low-cost, high-performance option for many OEMs and ODMs in various mobile, personal and network computing platforms.

Perspectives on high performance network computing

1997 ◽  
Vol 12 (5) ◽  
pp. 451-459
Author(s):  
V Strumpen ◽  
B Ramkumar ◽  
T.L Casavant ◽  
S.M Reddy
Keyword(s):  
High Performance ◽  
Network Computing

Characterization of Wide Area Network Computing

2000 ◽  
Author(s):  
Christopher J. Freitas ◽  
Derrick B. Coffin ◽  
Richard L. Murphy
Keyword(s):  
Message Passing ◽  
High Performance ◽  
Local Area ◽  
Wide Area ◽  
Area Network ◽  
Wide Area Network ◽  
Network Computing ◽  
Distributed Parallel Computing ◽  
International Border

Abstract Distributed parallel computing using message-passing techniques on Networks of Workstations (NOW) has achieved widespread use in the context of Local Area Networks (LAN). Recently, the concept of Grid-based computing using Wide Area Networks (WAN) has been proposed as a general solution to distributed high performance computing. The use of computers and resources at different geographic locations connected by a Wide Area Network and executing a real application introduces additional variables that potentially complicate the efficient use of these resources. Presented here are the results of a study that begins to characterize the performance issues of a WAN-based NOW, connecting resources that span an international border.

A High Performance Energy Analyzer for Use in Electron Scanning Microscopy

1969 ◽  
Vol 27 ◽  
pp. 14-15
Author(s):  
A. V. Crewe ◽  
M. Isaacson ◽  
D. Johnson
Keyword(s):  
High Performance ◽  
Vertical Plane ◽  
Median Plane ◽  
Electron Gun ◽  
Uniform Field ◽  
Loss Mechanism ◽  
Electron Scanning Microscopy ◽  
Sector Type ◽  
Double Focusing ◽  
Electron Energy Loss

A double focusing magnetic spectrometer has been constructed for use with a field emission electron gun scanning microscope in order to study the electron energy loss mechanism in thin specimens. It is of the uniform field sector type with curved pole pieces. The shape of the pole pieces is determined by requiring that all particles be focused to a point at the image slit (point 1). The resultant shape gives perfect focusing in the median plane (Fig. 1) and first order focusing in the vertical plane (Fig. 2).

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

Use of the Magnetostatic Analogue In Electromagnetic Lens Engineering

1970 ◽  
Vol 28 ◽  
pp. 360-361
Author(s):  
John W. Coleman
Keyword(s):  
Boundary Conditions ◽  
High Performance ◽  
Force Fields ◽  
Optical Design ◽  
Direct Conversion ◽  
Design Engineering ◽  
Design Data ◽  
Scalar Potentials ◽  
Geometric Elements ◽  
At Will

In the design engineering of high performance electromagnetic lenses, the direct conversion of electron optical design data into drawings for reliable hardware is oftentimes difficult, especially in terms of how to mount parts to each other, how to tolerance dimensions, and how to specify finishes. An answer to this is in the use of magnetostatic analytics, corresponding to boundary conditions for the optical design. With such models, the magnetostatic force on a test pole along the axis may be examined, and in this way one may obtain priority listings for holding dimensions, relieving stresses, etc..The development of magnetostatic models most easily proceeds from the derivation of scalar potentials of separate geometric elements. These potentials can then be conbined at will because of the superposition characteristic of conservative force fields.

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