Tantalum Capacitor Technology : Options for high-temperature and harsh-environment applications

2017 ◽  
Vol 4 (1) ◽  
pp. 43-47 ◽  
Author(s):  
Chris Reynolds
2009 ◽  
Vol 1 (1) ◽  
pp. 963-966 ◽  
Author(s):  
G. Tortissier ◽  
L. Blanc ◽  
A. Tetelin ◽  
J-L. Lachaud ◽  
M. Benoit ◽  
...  

Food Research ◽  
2019 ◽  
pp. 808-813
Author(s):  
Ubong A. ◽  
C.Y. New ◽  
L.C. Chai ◽  
Nur Fatihah A. ◽  
Nur Hasria K. ◽  
...  

Bacillus cereus spores are capable of surviving the harsh environment and more often, they cause great concern to the dairy industry. The current research was conducted to study the effect of temperature on germination and growth of B. cereus spores in UHT chocolate milk; the study was carried out at 8°C, 25°C and 35°C over a span of seven days. The results showed that no growth was observed at 8°C. At 25°C, a rapid increase in growth was observed as early as Day 1, from an initial count of ten spores to 4.01 log10 CFU/mL. Meanwhile, at 35°C, the growth on Day 1 was more rapid in which the count promptly increased to 8.07 log10 CFU/mL. Analysis of graph trend showed that the number of vegetative cells decreased while the number of spores increased with incubation time due to nutrients exhaustion. This study fills up the data gap towards understanding the possible issues that might arise in the actual scenario and at the same time, suggests a suitable approach to minimize infection risk caused by B. cereus spores.


2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000075-000081
Author(s):  
Ramesh Khanna ◽  
Srinivasan Venkataraman

Harsh Environment approved components/ designs require high reliability as well as availability of power to meet their system needs. The paper will explore the various design constrains imposed on the high temperature designs. Down hole oil and gas industry requires high reliability components that can withstand high temperature. Discrete component selection, packaging and constrains imposed by various specification requirements to meet harsh environment approval are critical aspect of high-temp designs. High temperature PCB material, PCB layout techniques, trace characteristics are an important aspect of high-temperature PCB design and will be explored in the article. Buck Converters are the basic building blocks, but in order to meet system requirements to power FPGA's where low output voltage and high currents are required. Converter must be able to provide wider step down ratios with high transient response so buck converters are used. The paper with explore the various features of a buck-based POL converter design. Low noise forces the need for Low-dropout (LDO) Regulators that can operate at high Temperatures up to 210°C. This paper will address the power requirements to meet system needs.


2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000111-000115
Author(s):  
Piers R. Tremlett

A polymer based electronic packaging system has been developed that is capable of operating at temperatures over 175°C and up to 225°C. This system is being developed to be a lead free, non-hermetic and able to deliver miniature or functionally dense circuits. It will be suitable for sensor systems where amplification, signal digitisation and autonomy are important whilst operating in a harsh environment such as high temperature.


2015 ◽  
Author(s):  
P. R. Ohodnicki ◽  
S. Credle ◽  
M. Buric ◽  
R. Lewis ◽  
S. Seachman

RSC Advances ◽  
2018 ◽  
Vol 8 (27) ◽  
pp. 14848-14853 ◽  
Author(s):  
Qian Wang ◽  
Dongliang Bai ◽  
Zhiwen Jin ◽  
Shengzhong (Frank) Liu

Perovskite single-crystalline wafer based photodetectors are prepared with broad photodetection, and show little degradation at high-temperature or with storage under ambient-conditions.


Author(s):  
Amir Hussain Idrisi ◽  
Abdel-Hamid Ismail Mourad ◽  
Beckry Abdel-Magid ◽  
Mohammad Mozumder ◽  
Yaser Afifi

Abstract Composite materials are being used in many industrial applications such as automobile, aerospace, marine, oil and gas industries due to their high strength to weight ratio. The long-term effect of sustained loads and environmental factors that include exposure to UV light, temperature, and moisture have been under investigation by many researchers. The major objective of this study is to evaluate the effects of harsh environment (e.g. seawater and high temperature) on the structural properties of E-glass epoxy composite materials. These effects were studied in terms of seawater absorption, permeation of salt and contaminants, chemical and physical bonds at the interface and degradation in mechanical properties. Samples were immersed in seawater at room temperature (23°C), 65°C and 90°C for the duration of 6 months. Results show that seawater absorption increased with immersion time at 23°C and 65°C, whereas the weight of the specimens decreased at 90°C. The moisture causes swelling at 23°C and 65°C and breakdown of chemical bonds between fiber and matrix at 90°C. It is observed that high temperature accelerates the degradation of the E-glass epoxy composite. At 90°C, the tensile strength of E-glass epoxy sharply decreased by 72.92% but no significant change was observed in modulus of elasticity of the composite.


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