The \"Coffee-Can\" Radar Redesigned as an Inexpensive RF PCB [Application Notes]

Jim Carroll; Gent Paparisto; David Vye

doi:10.1109/mmm.2016.2589201

The \"Coffee-Can\" Radar Redesigned as an Inexpensive RF PCB [Application Notes]

IEEE Microwave Magazine ◽

10.1109/mmm.2016.2589201 ◽

2016 ◽

Vol 17 (10) ◽

pp. 62-74 ◽

Cited By ~ 3

Author(s):

Jim Carroll ◽

Gent Paparisto ◽

David Vye

Keyword(s):

Rf Pcb

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RF Sensor Modules – Needs for Multifunctional Architectures

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016cicmt-tha25 ◽

2016 ◽

Vol 2016 (CICMT) ◽

pp. 000207-000210

Author(s):

Martin Oppermann ◽

Felix Thurow ◽

Ralf Rieger

Keyword(s):

Noise Figure ◽

Low Noise ◽

Low Noise Amplifier ◽

Low Loss ◽

Reflow Soldering ◽

Operating Modes ◽

Front End ◽

Multilayer Ceramic ◽

Noise Amplifier ◽

Rf Pcb

Abstract Next generation of RF sensor modules, mainly for airborne applications, will cover a variety of multifunction in terms of different operating modes, e.g. Radar, EW and Communications / Datalinks. The operating frequencies will cover a bandwidth of > 10 GHz and for realisation of modern Active Electronically Steered Antennas (AESA) the Transmit/Receive (T/R) modules have to match with challenging geometry demands, and RF requirements, like switching and filtering between different operational frequencies in transmit and receive mode. New GaN technology based MMICs, e.g. LNA, HPA are in development and multifunctional components (MFC MMICs) cover more than one RF function in one chip. Different front end demonstrators will be presented, based on multilayer ceramic (LTCC) and RF-PCB and associated assembly technologies, like chip&wire and SMD reflow soldering. These TRM front ends include a Low Noise Amplifier with an integrated Switch (LNA/SW) and for characterisation the measured Noise Figure (NF), a key characteristic for receive performance, will be compared. The need for high integration on module level is obvious and therefore specific demands for low loss ceramic and PCB based modules, packages and housings exist.

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