Introduction to the special section for the industry papers presented at the IEEE symposium on electromagnetic compatibility and signal integrity held in Santa Clara, California, USA, in March 2015

2016 ◽  
Vol 5 (4) ◽  
pp. 95-95
Author(s):  
Jun Fan ◽  
Bruce Archambeault
Keyword(s):  
Electromagnetic Compatibility ◽  
Special Section ◽  
Signal Integrity

Some Noteworthy Aspects in Designing High-Speed PCB

2013 ◽  
Vol 662 ◽  
pp. 846-850
Author(s):  
Jiang Hong ◽  
Zhi Wei Tang ◽  
Long Hu Chen
Keyword(s):  
System Design ◽  
Integrated Circuit ◽  
High Speed ◽  
Electromagnetic Compatibility ◽  
Signal Integrity ◽  
Design Rules ◽  
Pcb Design ◽  
Key Factor ◽  
Switch Rate ◽  
The Cost

With the increase of integrated circuit switch rate and PCB density, signal integrity has become one of the problems must be concerned in high-speed PCB design. How to fully consider EMC (Electromagnetic compatibility) and take effective measures has been a key factor of a system design. Based on the consideration of EMC, the author put forward some aspects in designing high-speed PCB. The optimized PCB design rules have steady and credible performance, the development period is shortened and the cost is reduced. The conclusions drawn from the dissertation are helpful to the design of high-speed PCB.

Signal Integrity Analysis for RF System-in-Package

2011 ◽  
Author(s):  
Jeff Chen ◽  
Weiping Li ◽  
Feng Ling
Keyword(s):  
Design Methodology ◽  
Electromagnetic Compatibility ◽  
Signal Integrity ◽  
Power Integrity ◽  
Rf System ◽  
Noise Coupling ◽  
Design Time ◽  
Close Proximity ◽  
First Pass ◽  
Integrity Analysis

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

Interference and Electromagnetic Compatibility Challenges in 5G Wireless Network Deployments

2017 ◽  
Vol 5 (3) ◽  
pp. 612
Author(s):  
Idrissa Abubakar ◽  
Jafri Din ◽  
Manhal Alhilali ◽  
Hong Yin Lam
Keyword(s):  
Wireless Network ◽  
Electromagnetic Interference ◽  
High Speed ◽  
Electromagnetic Compatibility ◽  
Signal Integrity ◽  
Energy Coupling ◽  
Mri Scan ◽  
Power Bus ◽  
Electromagnetic Devices ◽  
High Speed Data

<p>5G wireless network technology is going operate within the environment of other electrical, electronic and electromagnetic devices, components and systems, with capability of high speed data connectivity acting as network transceiver stations with Massive MIMO for Internet of Things (IoT). Considering the level of interoperability, electromagnetic Interference and electromagnetic compatibility to avoid electromagnetic pulse effects (EMP) which is capable of not only causing network malfunctions but total devices and equipments failure in mission critical operations, like hospital MRI scan machines, security profiling and data handling or even personal healthcare devices like heart pacemaker. Electromagnetic energy coupling in PCB due to: radiation, reflection and Crosstalk generates reliability challenges affecting Signal Integrity between traces of multilayer boards stalks, power bus and packaging creating Electromagnetic interference (EMI) in PCB leading false clock response to system failure. Above were considered very essential when deploying 5G wireless network facility as presented in this paper. </p>

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