A Sandwich-Type Thermoelectric Microwave Power Sensor for GaAs MMIC-Compatible Applications

Zhiqiang Zhang; Yu Guo; Fan Li; Yunyi Gong; Xiaoping Liao

doi:10.1109/led.2016.2619380

A Sandwich-Type Thermoelectric Microwave Power Sensor for GaAs MMIC-Compatible Applications

IEEE Electron Device Letters ◽

10.1109/led.2016.2619380 ◽

2016 ◽

Vol 37 (12) ◽

pp. 1639-1641 ◽

Cited By ~ 9

Author(s):

Zhiqiang Zhang ◽

Yu Guo ◽

Fan Li ◽

Yunyi Gong ◽

Xiaoping Liao

Keyword(s):

Microwave Power ◽

Sandwich Type ◽

Power Sensor

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Wideband Microwave Power Sensor Based on MEMS Technology

2004 Conference on Precision Electromagnetic Measurements ◽

10.1109/cpem.2004.305487 ◽

2004 ◽

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Author(s):

Ari Alastalo ◽

Jukka Kyynarainen ◽

Heikki Seppa ◽

Anu Karkkainen ◽

Nadine Pesonen ◽

...

Keyword(s):

Microwave Power ◽

Mems Technology ◽

Power Sensor

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High‐power up to 4 W characteristics of the capacitive microwave power sensor with grounded beam

Electronics Letters ◽

10.1049/el.2015.2844 ◽

2015 ◽

Vol 51 (22) ◽

pp. 1798-1800

Author(s):

Hao Yan ◽

Xiaoping Liao

Keyword(s):

High Power ◽

Microwave Power ◽

Power Sensor

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Optics and Precision Engineering ◽

10.3788/ope.20111901.0110 ◽

2011 ◽

Vol 19 (1) ◽

pp. 110-117 ◽

Cited By ~ 2

Author(s):

王德波 WANG De-bo ◽

廖小平 LIAO Xiao-ping

Keyword(s):

Microwave Power ◽

Power Sensor

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Application Consideration of Thermocouple-Based Microwave Power Sensor

2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) ◽

10.1109/nems.2018.8556880 ◽

2018 ◽

Author(s):

Jiabin Yan ◽

Xiaoping Liao

Keyword(s):

Microwave Power ◽

Power Sensor

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High-power electro-mechanical behavior of a capacitive microwave power sensor with warped cantilever beam

Solid-State Electronics ◽

10.1016/j.sse.2020.107877 ◽

2020 ◽

Vol 172 ◽

pp. 107877

Author(s):

Jian-hua Li ◽

Xiaoping Liao

Keyword(s):

Mechanical Behavior ◽

Cantilever Beam ◽

High Power ◽

Microwave Power ◽

Power Sensor

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2-D model of the indirectly-heated type microwave power sensor based on GaAs MMIC process

2013 IEEE SENSORS ◽

10.1109/icsens.2013.6717245 ◽

2013 ◽

Cited By ~ 2

Author(s):

Zhenxiang Yi ◽

Xiaoping Liao ◽

Hao Wu

Keyword(s):

Microwave Power ◽

Power Sensor ◽

D Model

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A microwave power sensor based on GaAs MMIC technology

Journal of Micromechanics and Microengineering ◽

10.1088/0960-1317/17/10/027 ◽

2007 ◽

Vol 17 (10) ◽

pp. 2132-2137 ◽

Cited By ~ 22

Author(s):

Lei Han ◽

Qing-An Huang ◽

Xiao-Ping Liao

Keyword(s):

Microwave Power ◽

Power Sensor

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3D model of the thermoelectric microwave power sensor by MEMS technology

2015 IEEE SENSORS ◽

10.1109/icsens.2015.7370571 ◽

2015 ◽

Author(s):

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Xiaoping Liao

Keyword(s):

Microwave Power ◽

3D Model ◽

Mems Technology ◽

Power Sensor

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A novel MEMS double-channel microwave power sensor based on GaAs MMIC technology

Sensors and Actuators A Physical ◽

10.1016/j.sna.2012.04.030 ◽

2012 ◽

Vol 188 ◽

pp. 95-102 ◽

Cited By ~ 7

Author(s):

De-bo Wang ◽

Xiao-ping Liao

Keyword(s):

Microwave Power ◽

Power Sensor ◽

Double Channel

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An Inline Type Microwave Power Sensor Using GaAs MMIC Process

2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems ◽

10.1109/nems.2006.334878 ◽

2006 ◽

Author(s):

Lei Han ◽

Qing An Huang ◽

Xiao Ping Liao

Keyword(s):

Microwave Power ◽

Power Sensor

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