Thin-Body N-Face GaN Transistor Fabricated by Direct Wafer Bonding

2011 ◽  
Vol 32 (7) ◽  
pp. 895-897 ◽  
Author(s):  
Kevin K. Ryu ◽  
John C. Roberts ◽  
Edwin L. Piner ◽  
Tomás Palacios
Keyword(s):  
Wafer Bonding ◽  
Thin Body ◽  
Direct Wafer Bonding

Thin Body III–V-Semiconductor-on-Insulator Metal–Oxide–Semiconductor Field-Effect Transistors on Si Fabricated Using Direct Wafer Bonding

2009 ◽  
Vol 2 (12) ◽  
pp. 124501 ◽  
Author(s):  
Masafumi Yokoyama ◽  
Tetsuji Yasuda ◽  
Hideki Takagi ◽  
Hisashi Yamada ◽  
Noboru Fukuhara ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Wafer Bonding ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Thin Body ◽  
Direct Wafer Bonding

High Quality Thin Body III-V-On-Insulator Channel Layer Transfer on Si Wafer Using Direct Wafer Bonding

2019 ◽  
Vol 33 (4) ◽  
pp. 391-401 ◽  
Author(s):  
Masafumi Yokoyama ◽  
Tetsuji Yasuda ◽  
Hideki Takagi ◽  
Hisashi Yamada ◽  
Yuji Urabe ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Thin Body ◽  
Layer Transfer ◽  
High Quality ◽  
Channel Layer ◽  
Direct Wafer Bonding ◽  
Si Wafer

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Low temperature GaAs/Si direct wafer bonding

2000 ◽  
Vol 36 (7) ◽  
pp. 677 ◽  
Author(s):  
M. Alexe ◽  
V. Dragoi ◽  
M. Reiche ◽  
U. Gösele
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Low Temperature Gaas

Point defects generated by direct-wafer bonding of silicon

2002 ◽  
Vol 31 (2) ◽  
pp. 113-118 ◽  
Author(s):  
L. Dózsa ◽  
B. Szentpáli ◽  
D. Pasquariello ◽  
K. Hjort
Keyword(s):  
Point Defects ◽  
Wafer Bonding ◽  
Direct Wafer Bonding

New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers

2019 ◽  
Vol 3 (6) ◽  
pp. 79-90 ◽  
Author(s):  
Bernard Aspar ◽  
Chrystelle Lagahe-Blanchard ◽  
Nicolas Sousbie ◽  
Jacques Margail ◽  
H. Moriceau
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
New Generation
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