Choice method of resistive composite materials with the specified complex of properties

Comparative Microstructures of Ion Milled and Electrochemically Thinned Composite Materials

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100052742 ◽

1974 ◽

Vol 32 ◽

pp. 546-547

Author(s):

R.R. Russell

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Composite Materials ◽

Great Difficulty ◽

Ion Milling ◽

Transmission Electron ◽

Ion Damage ◽

Intermetallic Composite

Transmission electron microscopy of metallic/intermetallic composite materials is most challenging since the microscopist typically has great difficulty preparing specimens with uniform electron thin areas in adjacent phases. The application of ion milling for thinning foils from such materials has been quite effective. Although composite specimens prepared by ion milling have yielded much microstructural information, this technique has some inherent drawbacks such as the possible generation of ion damage near sample surfaces.

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Transmission electron microscopy of composite materials

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100107125 ◽

1988 ◽

Vol 46 ◽

pp. 1012-1015

Author(s):

K.P.D. Lagerlof

Keyword(s):

Composite Materials ◽

Physical Properties ◽

Structural Defects ◽

Structural Composites ◽

Multiphase Materials ◽

Structural Reinforcement ◽

Transmission Electron ◽

Reinforced Fiber ◽

Particulate Reinforced Composites ◽

Definition Of

Although most materials contain more than one phase, and thus are multiphase materials, the definition of composite materials is commonly used to describe those materials containing more than one phase deliberately added to obtain certain desired physical properties. Composite materials are often classified according to their application, i.e. structural composites and electronic composites, but may also be classified according to the type of compounds making up the composite, i.e. metal/ceramic, ceramic/ceramie and metal/semiconductor composites. For structural composites it is also common to refer to the type of structural reinforcement; whisker-reinforced, fiber-reinforced, or particulate reinforced composites [1-4].For all types of composite materials, it is of fundamental importance to understand the relationship between the microstructure and the observed physical properties, and it is therefore vital to properly characterize the microstructure. The interfaces separating the different phases comprising the composite are of particular interest to understand. In structural composites the interface is often the weakest part, where fracture will nucleate, and in electronic composites structural defects at or near the interface will affect the critical electronic properties.

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Analysis of completed commercial semiconductors using EPMA

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100164970 ◽

1996 ◽

Vol 54 ◽

pp. 502-503

Author(s):

R. Packwood ◽

M.W. Phaneuf ◽

V. Weatherall ◽

I. Bassignana

Keyword(s):

Electron Probe Microanalysis ◽

Electron Probe ◽

Semiconductor Industry ◽

Detection Limits ◽

High Technology ◽

Depth Resolution ◽

Analytical Instruments ◽

Wide Range ◽

Numerous Element ◽

Choice Method

The development of specialized analytical instruments such as the SIMS, XPS, ISS etc., all with truly incredible abilities in certain areas, has given rise to the notion that electron probe microanalysis (EPMA) is an old fashioned and rather inadequate technique, and one that is of little or no use in such high technology fields as the semiconductor industry. Whilst it is true that the microprobe does not possess parts-per-billion sensitivity (ppb) or monolayer depth resolution it is also true that many times these extremes of performance are not essential and that a few tens of parts-per-million (ppm) and a few tens of nanometers depth resolution is all that is required. In fact, the microprobe may well be the second choice method for a wide range of analytical problems and even the method of choice for a few.The literature is replete with remarks that suggest the writer is confusing an SEM-EDXS combination with an instrument such as the Cameca SX-50. Even where this confusion does not exist, the literature discusses microprobe detection limits that are seldom stated to be as low as 100 ppm, whereas there are numerous element combinations for which 10-20 ppm is routinely attainable.

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