scholarly journals Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

2006 ◽  
Vol 94 (8) ◽  
pp. 1487-1501 ◽  
Author(s):  
M. Pedram ◽  
S. Nazarian
Keyword(s):  
Thermal Modeling ◽  
Vlsi Circuits ◽  
Modeling Analysis

Thermal modeling analysis of the IGBT integration shunt model

2015 ◽  
Author(s):  
Meng Zhaoliang ◽  
Yang Yuan ◽  
Gao Yong ◽  
Xi Gang ◽  
Han Liye ◽  
...  
Keyword(s):  
Thermal Modeling ◽  
Modeling Analysis

Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging Technology

2019 ◽  
Vol 2019 (1) ◽  
pp. 000306-000311
Author(s):  
Christopher Kapusta ◽  
Liang Yin ◽  
Kaustubh Nagarkar ◽  
Anisha Walwaikar ◽  
Krishnaswami Srihari
Keyword(s):  
Thermal Properties ◽  
High Power ◽  
Experimental Analysis ◽  
Thermal Modeling ◽  
Form Factors ◽  
Modeling Analysis ◽  
Integration Density ◽  
High Power Led ◽  
And Performance ◽  
Initial Results

Abstract In this paper, an “embedded chip” packaging platform using POL-kW packaging for use with High Power LED devices is presented. Prototype samples have been fabricated and tested. The authors will describe thermal modeling analysis as well as experimental results from the prototype samples. A thermal simulation model has been developed to look at the thermal properties and attributes of the POL-kW LED structure and will be compared to conventional AlN and IMS based LED packages. The process flow and fabrication details of a POL-kW LED package will be summarized to provide a better understanding of the technical and performance advantages. Initial results have shown that the presence of POL vias directly connected to the LED chip reduce the thermal path and, thereby, the thermal resistance of the package. Furthermore, the POL-kw LED package offers a thinner profile and smaller form factors which allows higher integration density.

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