Stress/strength and reliability evaluations on UBM in different solder systems

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) ◽

10.1109/itherm.2000.866191 ◽

2002 ◽

Cited By ~ 5

Author(s):

Y. Guo ◽

Shun-Meen Kuo ◽

L. Mercado

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