SPRUCE, an Embedded Compact Stack Machine for IGBT Power Modules

2016 ◽  
Author(s):  
A. Shorten ◽  
W. T. Ng
Keyword(s):  
Power Modules

PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5D Multi-Chip Power Modules

2021 ◽  
pp. 1-1
Author(s):  
Imam Alrazi ◽  
Quang Minh Le ◽  
Tristan Mark Evans ◽  
Shilpi Mukherjee ◽  
Homer Alan Mantooth ◽  
...  
Keyword(s):  
Design Automation ◽  
Power Modules

Thermal Equivalent Circuit Model of Multi-Die SiC Power Modules

2020 ELEKTRO ◽  
2020 ◽  
Author(s):  
A. Allegra ◽  
G. Scelba ◽  
M. Cacciato ◽  
G. Scarcella ◽  
N. Salerno ◽  
...  
Keyword(s):  
Equivalent Circuit ◽  
Equivalent Circuit Model ◽  
Circuit Model ◽  
Power Modules

scholarly journals Effect of load sequence interaction on bond-wire lifetime due to power cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Zoubir Khatir ◽  
Son-Ha Tran ◽  
Ali Ibrahim ◽  
Richard Lallemand ◽  
Nicolas Degrenne
Keyword(s):  
High Stress ◽  
Bipolar Transistors ◽  
Junction Temperature ◽  
Experimental Investigations ◽  
Power Cycling ◽  
Power Modules ◽  
Bond Wire ◽  
Load Sequence ◽  
The Difference ◽  
Heating Duration

AbstractExperimental investigations on the effects of load sequence on degradations of bond-wire contacts of Insulated Gate Bipolar Transistors power modules are reported in this paper. Both the junction temperature swing ($$\Delta T_{j}$$ Δ T j ) and the heating duration ($$t_{ON}$$ t ON ) are investigated. First, power cycling tests with single conditions (in $$\Delta T_{j}$$ Δ T j and $$t_{ON}$$ t ON ), are performed in order to serve as test references. Then, combined power cycling tests with two-level stress conditions have been done sequentially. These tests are carried-out in the two sequences: low stress/high stress (LH) and high stress/low stress (HL) for both $$\Delta T_{j}$$ Δ T j and $$t_{ON}$$ t ON . The tests conducted show that a sequencing in $$\Delta T_{j}$$ Δ T j regardless of the direction “high-low” or “low–high” leads to an acceleration of degradations and so, to shorter lifetimes. This is more pronounced when the difference between the stress levels is large. With regard to the heating duration ($$t_{ON}$$ t ON ), the effect seems insignificant. However, it is necessary to confirm the effect of this last parameter by additional tests.

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

2020 ◽  
Vol 31 (4) ◽  
pp. 3715-3726 ◽  
Author(s):  
Dongjin Kim ◽  
Chuantong Chen ◽  
Seung-Joon Lee ◽  
Shijo Nagao ◽  
Katsuaki Suganuma
Keyword(s):  
Thermal Fatigue ◽  
Power Modules ◽  
Sinter Joining

3.3 kV/1500 A power modules for the world’s first all-SiC traction inverter

2015 ◽  
Vol 54 (4S) ◽  
pp. 04DP07 ◽  
Author(s):  
Kenji Hamada ◽  
Shiro Hino ◽  
Naruhisa Miura ◽  
Hiroshi Watanabe ◽  
Shuhei Nakata ◽  
...  
Keyword(s):  
Power Modules
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