High Speed Routing Lookup IC Design for IPv6

2006 ◽  
Author(s):  
Yuan-Sun Chu ◽  
Hui-Kai Su ◽  
Po-Feng Lin ◽  
Ming-Jen Chen
Keyword(s):  
High Speed ◽  
Ic Design ◽  
Routing Lookup

scholarly journals IC Design of IPv6 Routing Lookup for High Speed Networks

2006 ◽  
pp. 184-187 ◽  
Author(s):  
Yuan-Sun Chu ◽  
Hui-Kai Su ◽  
Po-Feng Lin ◽  
Ming-Jen Chen
Keyword(s):  
High Speed ◽  
Ic Design ◽  
High Speed Networks ◽  
Routing Lookup

Performance Analysis of Interconnects Based on Carbon Nanotubes for AMS/RF IC Design

2015 ◽  
pp. 336-363 ◽  
Author(s):  
Rafael Vargas-Bernal
Keyword(s):  
Carbon Nanotubes ◽  
Performance Analysis ◽  
Integrated Circuit ◽  
High Speed ◽  
Electrical Current ◽  
Essential Elements ◽  
Thermal Dissipation ◽  
Electrical Performance ◽  
Ic Design ◽  
Rf Ic

Electrical interconnects are essential elements to transmit electrical current and/or to apply electrical voltage to the electronic devices found in an integrated circuit. With the introduction of carbon nanotubes in electronic applications, efficient and high-speed interconnects have allowed for optimizing the electrical performance of the integrated circuits. Additionally, technical problems, such as electromigration, large values of parasitic elements, large delays, and high thermal dissipation, presented in metallic interconnects based on copper, can be avoided. This chapter presents a performance analysis of interconnects used in AMS/RF IC design based on carbon nanotubes as the physical material where electrical variables are provided.

scholarly journals Fast 3D Integrated Circuit Placement Methodology using Merging Technique

2019 ◽  
Vol 69 (3) ◽  
pp. 217-222 ◽  
Author(s):  
Srinivas Sabbavarapu ◽  
Amit Acharyya ◽  
P. Balasubramanian ◽  
C. Ramesh Reddy
Keyword(s):  
Form Factor ◽  
Low Power ◽  
Integrated Circuit ◽  
High Speed ◽  
High Performance ◽  
Three Dimensional ◽  
Heterogeneous Systems ◽  
Reduced Form ◽  
Wire Length ◽  
Ic Design

In the recent years the advancement in the field of microelectronics integrated circuit (IC) design technologies proved to be a boon for design and development of various advanced systems in-terms of its reduction in form factor, low power, high speed and with increased capacity to incorporate more designs. These systems provide phenomenal advantage for armoured fighting vehicle (AFV) design to develop miniaturised low power, high performance sub-systems. One such emerging high-end technology to be used to develop systems with high capabilities for AFVs is discussed in this paper. Three dimensional IC design is one of the emerging field used to develop high density heterogeneous systems in a reduced form factor. A novel grouping based partitioning and merge based placement (GPMP) methodology for 3D ICs to reduce through silicon vias (TSVs) count and placement time is proposed. Unlike state-of-the-art techniques, the proposed methodology does not suffer from initial overlap of cells during intra-layer placement which reduces the placement time. Connectivity based grouping and partitioning ensures less number of TSVs and merge based placement further reduces intra layer wire-length. The proposed GPMP methodology has been extensively against the IBMPLACE database and performance has been compared with the latest techniques resulting in 12 per cent improvement in wire-length, 13 per cent reduction in TSV and 1.1x improvement in placement time.

High-speed Si-bipolar IC design for multi-Gb/s optical receivers

1991 ◽  
Vol 9 (5) ◽  
pp. 645-651 ◽  
Author(s):  
H. Hamano ◽  
T. Yamamoto ◽  
Y. Nishizawa ◽  
A. Tahara ◽  
H. Miyoshi ◽  
...  
Keyword(s):  
High Speed ◽  
Optical Receivers ◽  
Ic Design
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