Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898137 ◽

2014 ◽

Cited By ~ 3

Author(s):

Lado Filipovic ◽

Roberto Lacerda de Orio ◽

Siegfried Selberherr

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