Stress induced self aligned contact failure during tungsten-poly gate process in sub-60 nm memory device

Author(s):  
Min-Gyu Sung ◽  
Yong Soo Kim ◽  
Sung-Ki Park
2014 ◽  
Vol 1 ◽  
pp. 352-355 ◽  
Author(s):  
Atsushi YAO ◽  
Takashi HIKIHARA
Keyword(s):  

2016 ◽  
Vol 136 (6) ◽  
pp. 347-352 ◽  
Author(s):  
Tomoya Sato ◽  
Yu-ichi Hayashi ◽  
Takaaki Mizuki ◽  
Hideaki Sone

2012 ◽  
Vol 132 (6) ◽  
pp. 456-457
Author(s):  
Kazuya Uehara ◽  
Yu-Ichi Hayashi ◽  
Takaaki Mizuki ◽  
Hideaki Sone

2008 ◽  
Author(s):  
Augustin J. Hong ◽  
Kang L. Wang ◽  
Wei Lek Kwan ◽  
Yang Yang ◽  
Dayanara Parra ◽  
...  

Author(s):  
Jun Hirota ◽  
Ken Hoshino ◽  
Tsukasa Nakai ◽  
Kohei Yamasue ◽  
Yasuo Cho

Abstract In this paper, the authors report their successful attempt to acquire the scanning nonlinear dielectric microscopy (SNDM) signals around the floating gate and channel structures of the 3D Flash memory device, utilizing the custom-built SNDM tool with a super-sharp diamond tip. The report includes details of the SNDM measurement and process involved in sample preparation. With the super-sharp diamond tips with radius of less than 5 nm to achieve the supreme spatial resolution, the authors successfully obtained the SNDM signals of floating gate in high contrast to the background in the selected areas. They deduced the minimum spatial resolution and seized a clear evidence that the diffusion length differences of the n-type impurity among the channels are less than 21 nm. Thus, they concluded that SNDM is one of the most powerful analytical techniques to evaluate the carrier distribution in the superfine three dimensionally structured memory devices.


Author(s):  
T. Nukumizu ◽  
J. Sato ◽  
H. Furuya ◽  
H. Namba ◽  
T. Kikuch

Abstract EMS analysis is widely used in the failure analysis of the semiconductor. Moreover, the availability is widely evaluated. However, EMS analysis is not often used for the defect (1 Bit failure, Word Line failure, Bit Line failure, etc.) in the cell area in the memory device, because information on Fail Bit Map can be facilitated. Recently, make minutely advancing, and it is impossible to detect the defective cause only by Fail Bit Map information. We found the effectiveness as follows by the use of EMS analysis for a defective sample with Fail Bit Map information to solve such a problem. It leads to shortening analysis TAT because a defective part can be specified. Moreover, because the SHORT/OPEN mode can be divided, it is useful for the presumption of a defective mode. Furthermore, it is effective also to the confirmation of the presence of the redundancy and the confirmation of Fail Bit Map. Thus, because the application of EMS analysis for the defect in the cell area of the memory device is very effective to detect a defective cause, I want to recommend it by all means.


2016 ◽  
Vol 164 ◽  
pp. 53-58 ◽  
Author(s):  
Snigdha Bhattacharjee ◽  
Pranab Kumar Sarkar ◽  
Nandini Roy ◽  
Asim Roy

Metals ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1199
Author(s):  
Hojeong Ryu ◽  
Sungjun Kim

This study presents conductance modulation in a Pt/TiO2/HfAlOx/TiN resistive memory device in the compliance region for neuromorphic system applications. First, the chemical and material characteristics of the atomic-layer-deposited films were verified by X-ray photoelectron spectroscopy depth profiling. The low-resistance state was effectively controlled by the compliance current, and the high-resistance state was adjusted by the reset stop voltage. Stable endurance and retention in bipolar resistive switching were achieved. When a compliance current of 1 mA was imposed, only gradual switching was observed in the reset process. Self-compliance was used after an abrupt set transition to achieve a gradual set process. Finally, 10 cycles of long-term potentiation and depression were obtained in the compliance current region for neuromorphic system applications.


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