Stress induced self aligned contact failure during tungsten-poly gate process in sub-60 nm memory device
2012 ◽
Vol 132
(6)
◽
pp. 417-420
2016 ◽
Vol 136
(6)
◽
pp. 347-352
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2012 ◽
Vol 132
(6)
◽
pp. 456-457
2016 ◽
Vol 164
◽
pp. 53-58
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