Comparisons of mechanical reliabilities of Sn-3.0Ag-0.5Cu solder between ENIG and immersion Sn pad finishes

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2011.5992741 ◽

2011 ◽

Author(s):

Jae-Myeong Kim ◽

Myeong-Hyeok Jeong ◽

Sang-Hyun Kwon ◽

Sehoon Yoo ◽

Young-Bae Park

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